Details

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BUY FOD3150ASD SOP8 https://www.utsource.net/itm/p/11533712.html

Parameter	Symbol	Min	Typ	Max	Unit	Conditions/Notes
Input Forward Voltage	VIF	1.1	1.3	1.5	V	@ IF = 20 mA, TA = 25掳C
Input Current	IF	-	20	40	mA	Continuous
Output Collector-Emitter Voltage	VCEO	-	-	70	V	@ IO = 150 mA, TA = 25掳C
Output Collector Current	IC	-	150	200	mA	@ VCEO = 30 V, TA = 25掳C
Output Turn-On Time	ton	-	1.5	2.5	渭s	@ IF = 20 mA, RL = 150 惟, VCC = 15 V, TA = 25掳C
Output Turn-Off Time	toff	-	1.5	2.5	渭s	@ IF = 20 mA, RL = 150 惟, VCC = 15 V, TA = 25掳C
Isolation Voltage	VIORM	-	-	2500	VRMS	@ 1 minute, 50/60 Hz
Operating Temperature	TA	-40	-	125	掳C	Storage and operating temperature range
Storage Temperature	TSTG	-65	-	150	掳C	Storage temperature range

Instructions for Using FOD3150ASD SOP8:

1. Input Connection:

   • Connect the input side (pins 1 and 2) to your control signal source.
   • Ensure the input current does not exceed 40 mA to avoid damaging the device.

2. Output Connection:

   • Connect the output side (pins 5 and 6) to your load or circuit that needs to be controlled.
   • The maximum collector current is 200 mA, so ensure the load does not exceed this limit.

3. Power Supply:

   • Apply the appropriate power supply voltage to the output side, ensuring it does not exceed 70 V to prevent damage to the device.

4. Isolation:

   • The device provides isolation up to 2500 V_RMS for 1 minute at 50/60 Hz. Ensure that the input and output sides are properly isolated to avoid electrical hazards.

5. Temperature Considerations:

   • Operate the device within the temperature range of -40掳C to 125掳C for reliable performance.
   • Store the device in an environment with temperatures between -65掳C and 150掳C.

6. Timing Parameters:

   • The turn-on and turn-off times are typically around 1.5 渭s under standard conditions. Ensure your application can accommodate these timing parameters.

7. Handling Precautions:

   • Handle the device with care to avoid static discharge, which can damage the internal components.
   • Follow proper soldering techniques to avoid thermal stress during assembly.

8. Testing:

   • Before integrating the device into your final design, test it under the expected operating conditions to ensure it meets your requirements.

By following these instructions, you can ensure optimal performance and reliability of the FOD3150ASD SOP8 in your application.

(For reference only)