Details

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BUY 2SK2917 https://www.utsource.net/itm/p/11535007.html

Parameter	Symbol	Min	Typical	Max	Unit
Drain-Source Voltage	VDS	-	450	-	V
Gate-Source Voltage	VGS	-	卤20	-	V
Continuous Drain Current	ID	-	8	-	A
Pulsed Drain Current	ID(pulse)	-	16	-	A
Total Dissipation	PTOT	-	120	-	W
Junction Temperature	TJ	-	-	175	掳C
Storage Temperature Range	TSTG	-55	-	150	掳C

Instructions for Use:

1. Handling Precautions:

   • The 2SK2917 is sensitive to electrostatic discharge (ESD). Handle with care and use ESD protection equipment.
   • Avoid exceeding the maximum ratings specified in the table to prevent damage to the device.

2. Mounting:

   • Ensure proper heat sinking to manage the total dissipation (P_TOT). The junction temperature (T_J) should not exceed 175掳C.
   • Use thermal compound between the device and the heat sink to improve thermal conductivity.

3. Biasing:

   • Apply the gate-source voltage (V_GS) within the specified range (卤20V) to ensure reliable operation.
   • The drain-source voltage (V_DS) should not exceed 450V to avoid breakdown.

4. Current Handling:

   • The continuous drain current (I_D) should not exceed 8A. For pulsed applications, the pulsed drain current (I_D(pulse)) can go up to 16A.
   • Ensure that the current waveform does not cause excessive heating or stress on the device.

5. Storage:

   • Store the device in a dry, cool environment within the storage temperature range (-55掳C to 150掳C).
   • Avoid exposure to corrosive environments or high humidity.

6. Testing:

   • When testing the device, use appropriate test equipment and follow safety guidelines to prevent damage.
   • Verify all connections and settings before applying power.

7. Soldering:

   • Use a soldering iron with a temperature no higher than 300掳C and complete the soldering process within 10 seconds.
   • Allow the device to cool down to room temperature before applying power.

By following these instructions, you can ensure the reliable and efficient operation of the 2SK2917.

(For reference only)