Details

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BUY IRFP7530PBF https://www.utsource.net/itm/p/11535057.html

Parameter	Symbol	Min	Typical	Max	Unit	Notes
Drain-Source Voltage	VDS	-		100	V
Gate-Source Voltage	VGS	-15		20	V
Continuous Drain Current	ID	-	48	60	A	@ TC = 25掳C, VGS = 10V
Pulse Drain Current	ID(p)	-	120	-	A	@ tp = 10ms, IGM = 48A, VGS = 10V
Power Dissipation	PTOT	-		340	W	@ TC = 25掳C
Junction Temperature	TJ	-		175	掳C
Storage Temperature	TSTG	-55		150	掳C
Thermal Resistance	R胃JC	-	0.5	-	掳C/W	Case to Junction
Total Gate Charge	QG	-	94	-	nC	@ VGS = 10V, VDS = 50V, ID = 30A
Input Capacitance	Ciss	-	1450	-	pF	@ VDS = 25V, f = 1MHz
Output Capacitance	Coss	-	340	-	pF	@ VDS = 25V, f = 1MHz
Reverse Transfer Capacitance	Crss	-	110	-	pF	@ VDS = 25V, f = 1MHz
On-State Resistance	RDS(on)	-	4.5	-	m惟	@ VGS = 10V, ID = 30A, TJ = 25掳C

Instructions for Use:

1. Mounting and Handling:

   • Ensure proper heat sinking to manage the thermal resistance and keep the junction temperature within safe limits.
   • Handle the device with care to avoid damage to the leads and the die.

2. Biasing and Operation:

   • Apply the gate-source voltage (V_GS) within the specified range to avoid damaging the device.
   • Ensure that the drain-source voltage (V_DS) does not exceed the maximum rating to prevent breakdown.

3. Current Limiting:

   • Do not exceed the continuous drain current (I_D) or pulse drain current (I_D(p)) ratings to avoid overheating and potential failure.
   • Use appropriate current limiting resistors if necessary.

4. Thermal Management:

   • Monitor the junction temperature (T_J) and ensure it remains below the maximum rating.
   • Use thermal paste or other thermal management techniques to improve heat dissipation.

5. Storage and Environment:

   • Store the device in a dry, cool environment to prevent moisture damage.
   • Avoid exposing the device to temperatures outside the storage temperature range (T_STG).

6. Testing and Troubleshooting:

   • Test the device under controlled conditions to verify its performance parameters.
   • If the device fails to meet specifications, check for proper biasing, thermal management, and environmental conditions.

(For reference only)