IRG4PF50WPBF

IRG4PF50WPBF

Category: Transistors

Specifications
SKU
11545235
Details

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Parameter Symbol Min Typical Max Unit
Drain-Source Voltage VDS - 500 - V
Gate-Source Voltage VGS -15 - 15 V
Continuous Drain Current ID - 26.3 - A (TC=25掳C)
Power Dissipation PTOT - - 190 W (TC=25掳C)
Junction Temperature TJ - - 175 掳C
Storage Temperature TSTG -55 - 150 掳C
Total Gate Charge QG - 180 - nC
Input Capacitance Ciss - 2500 - pF
Output Capacitance Coss - 350 - pF
Reverse Transfer Capacitance Crss - 550 - pF
Turn-on Delay Time td(on) - 33 - ns
Rise Time tr - 22 - ns
Turn-off Delay Time td(off) - 38 - ns
Fall Time tf - 24 - ns

Instructions for Use:

  1. Handling and Storage:

    • Store the device in a dry, cool place to prevent moisture damage.
    • Handle the device with care to avoid mechanical stress or damage to the pins.
  2. Mounting:

    • Ensure proper heat sinking to manage the power dissipation, especially when operating at high current levels.
    • Use appropriate mounting hardware to secure the device and ensure good thermal contact.
  3. Electrical Connections:

    • Connect the gate to a suitable driver circuit to control the switching action.
    • Ensure that the drain and source connections are made with low-inductance paths to minimize voltage spikes during switching.
  4. Gate Drive:

    • Apply a gate-source voltage (VGS) within the specified range to turn the device on and off.
    • Use a gate resistor to control the switching speed and reduce electromagnetic interference (EMI).
  5. Thermal Management:

    • Monitor the junction temperature (TJ) to ensure it does not exceed the maximum rating.
    • Use thermal paste or thermal interface materials to enhance heat transfer from the device to the heatsink.
  6. Overvoltage Protection:

    • Implement overvoltage protection circuits to safeguard against voltage transients that could exceed the maximum drain-source voltage (VDS).
  7. Reverse Bias Safe Operating Area (RBSOA):

    • Ensure that the device operates within its RBSOA to prevent damage due to reverse bias conditions.
  8. Data Sheet Compliance:

    • Always refer to the latest data sheet for the most accurate and up-to-date information on the device parameters and recommended operating conditions.
(For reference only)

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