Details

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BUY TLP291(GB-TP,SE( https://www.utsource.net/itm/p/11545456.html

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Forward Voltage (VF)	VF	-	1.2	1.8	V	IF = 10 mA, TA = 25掳C
Reverse Breakdown Voltage (VBR)	VBR	-	5	-	V	IR = 1 mA, TA = 25掳C
Forward Current (IF)	IF	-	-	50	mA	TA = 25掳C
Reverse Current (IR)	IR	-	-	10	渭A	VR = 5 V, TA = 25掳C
Storage Temperature (TSTG)	TSTG	-40	-	110	掳C	-
Operating Temperature (TA)	TA	-40	-	105	掳C	-
Output Leakage Current (IOL)	IOL	-	-	1	渭A	VCC = 0 V, TA = 25掳C
Propagation Delay Time (tPLH, tPHL)	tPLH, tPHL	-	1.5	4.5	渭s	VCC = 5 V, IF = 5 mA, RL = 470 惟, TA = 25掳C
Maximum Power Dissipation (PD)	PD	-	-	125	mW	TA = 25掳C

Instructions for Using TLP291(GB-TP,SE):

1. Mounting and Handling:

   • Handle the device with care to avoid mechanical damage.
   • Ensure that the device is mounted on a PCB with proper soldering techniques to prevent thermal and electrical issues.

2. Power Supply:

   • The device operates with a supply voltage (V_CC) typically ranging from 3 V to 30 V.
   • Ensure that the supply voltage does not exceed the maximum rating to avoid damage.

3. Forward Current:

   • The forward current (I_F) should be kept within the specified limits to prevent overheating and potential failure.
   • Use appropriate current-limiting resistors if necessary.

4. Reverse Voltage:

   • The reverse voltage (V_BR) should not exceed the maximum rating to avoid breakdown and damage to the device.

5. Temperature Considerations:

   • The operating temperature range (T_A) is from -40掳C to 105掳C.
   • The storage temperature range (T_STG) is from -40掳C to 110掳C.
   • Ensure that the device is used within these temperature ranges to maintain reliable operation.

6. Output Leakage Current:

   • The output leakage current (I_OL) is typically very low but should be considered in high-impedance circuits.

7. Propagation Delay:

   • The propagation delay time (t_PLH, t_PHL) is important for timing considerations in digital circuits.
   • Ensure that the delay times are within acceptable limits for your application.

8. Power Dissipation:

   • The maximum power dissipation (P_D) should not be exceeded to avoid thermal issues.
   • Proper heat sinking or cooling may be required for high-power applications.

9. Storage and Handling:

   • Store the device in a dry, cool place to prevent moisture damage.
   • Follow ESD (Electrostatic Discharge) precautions when handling the device to avoid damage.

10. Testing and Verification:

    • Test the device in a controlled environment to ensure it meets the specified parameters.
    • Verify the functionality of the device in the final application before mass production.

(For reference only)