Details

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BUY HCPL2531SD https://www.utsource.net/itm/p/11545631.html

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Forward Voltage	VF	-	1.2	1.6	V	IF = 20 mA, TA = 25掳C
Forward Current	IF	-	20	50	mA	VF = 1.6V, TA = 25掳C
Reverse Voltage	VR	-	-	5	V	IR = 1 渭A, TA = 25掳C
Reverse Current	IR	-	-	100	nA	VR = 5V, TA = 25掳C
Output Current (Low)	IOL	15	25	35	mA	VOL = 0.4V, TA = 25掳C
Output Current (High)	IOH	-	-	2.5	mA	VOH = 2.4V, TA = 25掳C
Output Low Voltage	VOL	0	0.4	0.8	V	IOL = 25 mA, TA = 25掳C
Output High Voltage	VOH	2.4	2.7	3.4	V	IOH = 2.5 mA, TA = 25掳C
Propagation Delay Time	tpd	150	250	350	ns	VCC = 5V, IF = 20 mA, RL = 500 惟, TA = 25掳C
Rise Time	tr	100	200	300	ns	VCC = 5V, IF = 20 mA, RL = 500 惟, TA = 25掳C
Fall Time	tf	100	200	300	ns	VCC = 5V, IF = 20 mA, RL = 500 惟, TA = 25掳C
Isolation Voltage	VIORM	-	-	2500	VRMS	1 minute, 50/60 Hz, TA = 25掳C
Operating Temperature Range	TA	-40	-	85	掳C	-
Storage Temperature Range	TSTG	-55	-	150	掳C	-

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the specified range (typically 4.75V to 5.25V).
   • Connect the power supply to the appropriate pins as per the datasheet.

2. Input Signal:

   • Apply the input signal to the LED side of the optocoupler.
   • The forward current (I_F) should be kept within the recommended range (20 mA typical).

3. Output Signal:

   • The output side of the optocoupler will switch based on the input signal.
   • Ensure the load resistance (R_L) is appropriate for the output current requirements.

4. Propagation Delay:

   • Account for the propagation delay time (t_pd) when designing your circuit to avoid timing issues.

5. Isolation:

   • The HCPL2531SD provides galvanic isolation between the input and output sides. Ensure that the isolation voltage (V_IORM) is not exceeded.

6. Temperature Considerations:

   • Operate the device within the specified temperature ranges to ensure reliable performance.
   • Store the device in a suitable environment to prevent damage.

7. Handling:

   • Handle the device with care to avoid static discharge, which can damage the sensitive components.
   • Follow proper soldering techniques to avoid thermal stress during assembly.

(For reference only)