CD4010BE
Specifications
SKU
11546546
Details
BUY CD4010BE https://www.utsource.net/itm/p/11546546.html
IC BUFFER NON-INVERT 18 V 16DIP
| Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Supply Voltage | VDD | - | 3 | - | 15 | V |
| Input Low Voltage | VIL | IL = 1.0 mA | 0 | - | 0.8 | V |
| Input High Voltage | VIH | IH = -1.0 mA | 2 | - | VDD - 0.8 | V |
| Output Low Voltage | VOL | IOL = 10 mA | 0 | - | 0.4 | V |
| Output High Voltage | VOH | IOH = -100 μA | VDD - 2.5 | - | VDD - 0.5 | V |
| Propagation Delay Time | tpd | VDD = 5 V, VI = VDD/2 | - | 16 | - | ns |
| Power Dissipation | PD | Ta = 25°C | - | - | 100 | mW |
| Operating Temperature Range | Ta | - | -40 | - | 85 | °C |
Instructions for Use:
Supply Voltage (VDD):
- Ensure the supply voltage is within the range of 3V to 15V.
- Do not exceed the maximum supply voltage to avoid damaging the device.
Input Voltage Levels:
- For a logic low input, ensure the voltage is between 0V and 0.8V.
- For a logic high input, ensure the voltage is between 2V and (VDD - 0.8V).
Output Voltage Levels:
- When the output is low, the voltage should be between 0V and 0.4V.
- When the output is high, the voltage should be between (VDD - 2.5V) and (VDD - 0.5V).
Propagation Delay Time (tpd):
- The typical propagation delay time is 16 ns at a supply voltage of 5V and an input voltage of VDD/2.
- This parameter is crucial for timing considerations in digital circuits.
Power Dissipation (PD):
- The maximum power dissipation is 100 mW at 25°C ambient temperature.
- Ensure adequate heat dissipation if operating near the maximum power limit.
Operating Temperature Range:
- The device can operate reliably within the temperature range of -40°C to 85°C.
- Avoid operating outside this range to prevent performance degradation or failure.
Handling and Storage:
- Handle the device with care to avoid static damage.
- Store in a dry, cool place away from direct sunlight and corrosive substances.
Mounting and Soldering:
- Follow recommended soldering profiles to avoid thermal stress.
- Ensure proper alignment and secure mounting on the PCB.
Testing:
- Use appropriate test equipment and methods to verify functionality.
- Test under typical operating conditions to ensure reliable performance.
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