CD4010BE

CD4010BE


Specifications
SKU
11546546
Details

BUY CD4010BE https://www.utsource.net/itm/p/11546546.html
IC BUFFER NON-INVERT 18 V 16DIP
Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage VDD - 3 - 15 V
Input Low Voltage VIL IL = 1.0 mA 0 - 0.8 V
Input High Voltage VIH IH = -1.0 mA 2 - VDD - 0.8 V
Output Low Voltage VOL IOL = 10 mA 0 - 0.4 V
Output High Voltage VOH IOH = -100 μA VDD - 2.5 - VDD - 0.5 V
Propagation Delay Time tpd VDD = 5 V, VI = VDD/2 - 16 - ns
Power Dissipation PD Ta = 25°C - - 100 mW
Operating Temperature Range Ta - -40 - 85 °C

Instructions for Use:

  1. Supply Voltage (VDD):

    • Ensure the supply voltage is within the range of 3V to 15V.
    • Do not exceed the maximum supply voltage to avoid damaging the device.
  2. Input Voltage Levels:

    • For a logic low input, ensure the voltage is between 0V and 0.8V.
    • For a logic high input, ensure the voltage is between 2V and (VDD - 0.8V).
  3. Output Voltage Levels:

    • When the output is low, the voltage should be between 0V and 0.4V.
    • When the output is high, the voltage should be between (VDD - 2.5V) and (VDD - 0.5V).
  4. Propagation Delay Time (tpd):

    • The typical propagation delay time is 16 ns at a supply voltage of 5V and an input voltage of VDD/2.
    • This parameter is crucial for timing considerations in digital circuits.
  5. Power Dissipation (PD):

    • The maximum power dissipation is 100 mW at 25°C ambient temperature.
    • Ensure adequate heat dissipation if operating near the maximum power limit.
  6. Operating Temperature Range:

    • The device can operate reliably within the temperature range of -40°C to 85°C.
    • Avoid operating outside this range to prevent performance degradation or failure.
  7. Handling and Storage:

    • Handle the device with care to avoid static damage.
    • Store in a dry, cool place away from direct sunlight and corrosive substances.
  8. Mounting and Soldering:

    • Follow recommended soldering profiles to avoid thermal stress.
    • Ensure proper alignment and secure mounting on the PCB.
  9. Testing:

    • Use appropriate test equipment and methods to verify functionality.
    • Test under typical operating conditions to ensure reliable performance.
(For reference only)

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