Details

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BUY NJW1302G NJW3281G https://www.utsource.net/itm/p/11547122.html

Parameter	NJW1302G	NJW3281G
Type	DC-DC Converter	DC-DC Converter
Input Voltage Range (VIN)	2.7V to 5.5V	2.7V to 5.5V
Output Voltage (VOUT)	1.8V, 2.5V, 3.0V, 3.3V	1.8V, 2.5V, 3.0V, 3.3V
Output Current (IOUT)	300mA	600mA
Switching Frequency (fSW)	1.2MHz	1.2MHz
Efficiency (畏)	Up to 95%	Up to 95%
Quiescent Current (IQ)	30渭A	30渭A
Shutdown Current (ISD)	1渭A	1渭A
Package	SOT-23-5	SOT-23-5
Operating Temperature Range (Tamb)	-40掳C to +85掳C	-40掳C to +85掳C
Protection Features	Overcurrent Protection, Thermal Shutdown	Overcurrent Protection, Thermal Shutdown

Instructions for Use

NJW1302G

1. Circuit Configuration:

   • Connect the input voltage (VIN) to the VIN pin.
   • Connect the output voltage (VOUT) to the VOUT pin.
   • Ground the GND pin.
   • Connect the FB pin to a voltage divider to set the output voltage.
   • Connect the EN pin to a control signal or leave it open for continuous operation.

2. Capacitors:

   • Use a 1渭F ceramic capacitor for the input (CIN) and a 1渭F ceramic capacitor for the output (COUT).

3. Inductor:

   • Use a 2.2渭H inductor for optimal performance.

4. Thermal Management:

   • Ensure adequate heat dissipation by using a PCB with good thermal vias and copper planes.

5. Layout Considerations:

   • Keep the input and output capacitors as close as possible to the IC.
   • Minimize the loop area for the high-frequency switching currents.

NJW3281G

1. Circuit Configuration:

   • Connect the input voltage (VIN) to the VIN pin.
   • Connect the output voltage (VOUT) to the VOUT pin.
   • Ground the GND pin.
   • Connect the FB pin to a voltage divider to set the output voltage.
   • Connect the EN pin to a control signal or leave it open for continuous operation.

2. Capacitors:

   • Use a 1渭F ceramic capacitor for the input (CIN) and a 1渭F ceramic capacitor for the output (COUT).

3. Inductor:

   • Use a 2.2渭H inductor for optimal performance.

4. Thermal Management:

   • Ensure adequate heat dissipation by using a PCB with good thermal vias and copper planes.

5. Layout Considerations:

   • Keep the input and output capacitors as close as possible to the IC.
   • Minimize the loop area for the high-frequency switching currents.

Additional Notes:

• Both devices are designed for low-power applications and offer high efficiency and small form factors.
• Always refer to the datasheet for detailed specifications and application notes.

(For reference only)