ISL62882CHRTZ

ISL62882CHRTZ

Category: IC Chips

Specifications
SKU
11548219
Details

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IC REG CONV INTEL 1OUT 40TQFN
Parameter Symbol Min Typ Max Unit Notes
Input Voltage VIN 4.5 - 14 V Operating range
Output Voltage VOUT 0.6 - 5.5 V Adjustable with external resistors
Switching Frequency fSW 300 500 1000 kHz Adjustable with external resistor
Efficiency η - 92 - % At full load
Load Current IOUT - 10 20 A Continuous output current
Quiescent Current IQ - 100 - μA At no load
Shutdown Current ISD - 1 - μA In shutdown mode
Thermal Shutdown Temperature TSD - 160 - °C Automatic recovery
Storage Temperature TSTG -40 - 125 °C Storage and operation range
Operating Junction Temperature TJ -40 - 125 °C Operating range

Instructions for ISL62882CHRTZ:

  1. Power Supply Connection:

    • Connect the input voltage (VIN) to the power supply.
    • Ensure the input voltage is within the operating range (4.5V to 14V).
  2. Output Voltage Setting:

    • Use external resistors to set the desired output voltage (VOUT).
    • The output voltage can be adjusted from 0.6V to 5.5V using the feedback resistor network.
  3. Switching Frequency Adjustment:

    • Adjust the switching frequency (fSW) by connecting an external resistor to the FREQ pin.
    • The typical switching frequency range is 300kHz to 1000kHz.
  4. Thermal Management:

    • Ensure adequate heat dissipation to keep the junction temperature (TJ) within the operating range (-40°C to 125°C).
    • Use a heatsink if necessary, especially under high load conditions.
  5. Protection Features:

    • The device includes thermal shutdown protection, which activates at temperatures above 160°C.
    • The device will automatically recover once the temperature drops below the threshold.
  6. Shutdown Mode:

    • To enter shutdown mode, pull the EN pin low.
    • The shutdown current (ISD) is typically 1μA.
  7. Storage and Handling:

    • Store the device in a dry environment within the storage temperature range (-40°C to 125°C).
    • Handle with care to avoid damage to the pins and internal components.
  8. Layout Considerations:

    • Place the input and output capacitors close to the device to minimize parasitic inductance.
    • Use wide traces for power and ground connections to reduce resistance and inductance.
  9. Testing and Validation:

    • After assembly, test the device under various load conditions to ensure stable operation.
    • Verify the output voltage and efficiency to meet design specifications.
  10. Compliance:

    • Ensure the design complies with relevant safety and regulatory standards for the intended application.
(For reference only)

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