Details
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Parameter | Symbol | Min | Typ | Max | Unit | Description |
---|---|---|---|---|---|---|
Supply Voltage | VCC | 1.6 | - | 5.5 | V | Operating supply voltage range |
Output Current | IO | - | 200 | - | mA | Continuous output current |
Quiescent Current | IQ | - | 1.5 | 2.5 | 渭A | Current consumption at no load |
Dropout Voltage | VDO | - | 180 | 300 | mV | Voltage difference between input and output |
Thermal Shutdown | TSD | - | 160 | 170 | 掳C | Temperature at which the device shuts down |
Operating Temperature | TA | -40 | - | 125 | 掳C | Ambient temperature range |
Storage Temperature | TSTG | -65 | - | 150 | 掳C | Temperature range for storage |
Instructions:
Power Supply Connection:
- Connect the positive terminal of the power supply to the VIN pin.
- Connect the ground (GND) to the GND pin.
Output Connection:
- Connect the load to the VOUT pin.
- Ensure the load does not exceed the maximum output current (200 mA).
Capacitors:
- Place a 1 渭F ceramic capacitor between VIN and GND close to the device.
- Place a 1 渭F ceramic capacitor between VOUT and GND close to the device.
Thermal Management:
- Ensure adequate heat dissipation if operating near the maximum output current or in high ambient temperatures.
- Use a heatsink if necessary to maintain the device within the operating temperature range.
Thermal Shutdown:
- The device will automatically shut down if the junction temperature exceeds 160掳C to prevent damage.
- Allow the device to cool before resuming operation.
Storage:
- Store the device in a dry environment within the specified storage temperature range (-65掳C to 150掳C).
Handling:
- Handle with care to avoid static discharge, which can damage the device.
- Follow proper ESD (Electrostatic Discharge) precautions during handling and installation.
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