Details

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BUY SI2309CDS-T1-GE3 https://www.utsource.net/itm/p/11551845.html

Parameter	Description	Value
Part Number	Full Part Number	SI2309CDS-T1-GE3
Type	Device Type	N-Channel MOSFET
Package	Package Type	TO-252 (DPAK)
VDSS	Drain-to-Source Voltage	60V
RDS(on)	On-State Resistance at VGS = 10V	8.5m惟
ID	Continuous Drain Current	14A
Ptot	Total Power Dissipation (Ta = 25掳C)	2.2W
Qg	Total Gate Charge	27nC
fmax	Maximum Operating Frequency	5MHz
VGS(th)	Gate Threshold Voltage	1.0V to 2.5V
TJ	Junction Temperature Range	-55掳C to 150掳C
Storage Temperature Range	Storage Temperature	-65掳C to 150掳C

Instructions for Use:

1. Mounting and Handling:

   • Ensure that the device is handled with care to avoid damage to the leads or the body.
   • Follow proper ESD (Electrostatic Discharge) precautions to prevent damage to the MOSFET.

2. Soldering:

   • Use a soldering iron with a temperature setting between 260掳C and 300掳C.
   • Solder each lead for no more than 5 seconds.
   • Allow the device to cool naturally after soldering.

3. Thermal Management:

   • Ensure adequate heat sinking to maintain the junction temperature within the specified range.
   • Use thermal paste or a thermal pad to improve heat transfer from the device to the heatsink.

4. Electrical Connections:

   • Connect the drain, source, and gate terminals correctly to avoid damage.
   • Ensure that the gate voltage does not exceed the maximum ratings.
   • Use decoupling capacitors close to the power supply pins to reduce noise and improve stability.

5. Operating Conditions:

   • Operate the device within the specified voltage and current limits.
   • Monitor the temperature of the device during operation to ensure it does not exceed the maximum junction temperature.

6. Testing:

   • Use a multimeter or an oscilloscope to verify the correct operation of the MOSFET.
   • Test the device under load conditions to ensure it meets the required performance specifications.

7. Storage:

   • Store the device in a dry, cool place away from direct sunlight.
   • Keep the device in its original packaging until ready for use to protect against moisture and static damage.

(For reference only)