Details

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BUY NSS60600MZ4T1G https://www.utsource.net/itm/p/11552153.html

Parameter	Symbol	Min	Typical	Max	Unit	Notes
Drain-Source Voltage	VDS	-	-	600	V
Gate-Source Voltage	VGS	-20	-	20	V
Continuous Drain Current	ID	-	-	60	A	@ TC = 25掳C
Pulse Drain Current	ID(p)	-	-	180	A	@ TC = 25掳C, tp = 10 渭s, Duty Cycle = 1%
Power Dissipation	PTOT	-	-	360	W	@ TC = 25掳C
Junction Temperature	TJ	-	-	175	掳C
Storage Temperature	TSTG	-55	-	150	掳C
Thermal Resistance, Junction to Case	R胃JC	-	0.35	-	掳C/W
Total Gate Charge	QG	-	100	-	nC
Input Capacitance	Ciss	-	2500	-	pF	@ VDS = 300 V, f = 1 MHz
Output Capacitance	Coss	-	90	-	pF	@ VDS = 300 V, f = 1 MHz
Reverse Transfer Capacitance	Crss	-	260	-	pF	@ VDS = 300 V, f = 1 MHz
On-State Resistance	RDS(on)	-	0.044	-	惟	@ VGS = 10 V, ID = 60 A
Turn-On Delay Time	td(on)	-	10	-	ns	@ VGS = 10 V, ID = 10 A, Rg = 3.3 惟
Rise Time	tr	-	25	-	ns	@ VGS = 10 V, ID = 10 A, Rg = 3.3 惟
Turn-Off Delay Time	td(off)	-	15	-	ns	@ VGS = 10 V, ID = 10 A, Rg = 3.3 惟
Fall Time	tf	-	30	-	ns	@ VGS = 10 V, ID = 10 A, Rg = 3.3 惟

Instructions:

1. Handling and Storage:

   • Store the device in a dry, cool place.
   • Handle with care to avoid mechanical damage.
   • Use proper ESD (Electrostatic Discharge) protection when handling.

2. Mounting:

   • Ensure proper heat sinking to maintain junction temperature within safe limits.
   • Use a thermal interface material (TIM) for better thermal conductivity between the device and the heatsink.

3. Biasing:

   • Apply the gate-source voltage (V_GS) carefully to avoid exceeding the maximum ratings.
   • Use appropriate gate resistors to control switching times and reduce electromagnetic interference (EMI).

4. Operation:

   • Operate the device within the specified current and voltage limits to ensure reliable performance.
   • Monitor the junction temperature to prevent overheating and potential damage.

5. Testing:

   • Use recommended test conditions to verify the device parameters.
   • Ensure that all test equipment is calibrated and in good working condition.

6. Soldering:

   • Follow the recommended soldering profile to avoid thermal shock.
   • Allow the device to cool down before testing or further assembly.

7. Safety:

   • Always follow safety guidelines and regulations when working with high voltages and currents.
   • Use appropriate personal protective equipment (PPE) as necessary.

(For reference only)