SN74LS244NSR

SN74LS244NSR


Specifications
SKU
11552237
Details

BUY SN74LS244NSR https://www.utsource.net/itm/p/11552237.html
IC BUFFER NON-INVERT 5.25V 20SO
Parameter Symbol Min Typ Max Unit Conditions
Supply Voltage VCC 4.75 5.0 5.25 V Operating
Input Voltage (High) VIH 2.0 - VCC V Input High Level
Input Voltage (Low) VIL 0 - 0.8 V Input Low Level
Output Voltage (High) VOH 2.4 - VCC - 0.5 V Output High Level
Output Voltage (Low) VOL 0 - 0.5 V Output Low Level
Input Current II -1.0 - 1.0 mA Input Pin
Output Current (Source) IO - - 4.0 mA Output Pin (High)
Output Current (Sink) IO -8.0 - - mA Output Pin (Low)
Propagation Delay Time tpd - 18 - ns VCC = 5V, TA = 25°C
Power Consumption Ptot - 100 - mW VCC = 5V, All Outputs at VOH or VOL

Instructions for Use:

  1. Supply Voltage:

    • Ensure the supply voltage is within the specified range (4.75V to 5.25V) to avoid damage to the device.
  2. Input Levels:

    • Input voltages should be within the specified high (VIH) and low (VIL) levels to ensure proper operation.
  3. Output Levels:

    • The output voltages should be monitored to ensure they remain within the specified high (VOH) and low (VOL) levels.
  4. Current Limits:

    • Do not exceed the maximum input and output current ratings to prevent damage to the device.
  5. Propagation Delay:

    • The propagation delay time is crucial for timing considerations in your circuit. Ensure that your design accounts for this delay.
  6. Power Consumption:

    • Monitor the total power consumption to ensure it does not exceed the maximum rating.
  7. Operating Temperature:

    • The device is typically rated for operation over a temperature range from -40°C to 85°C. Ensure the operating environment stays within these limits.
  8. Storage and Handling:

    • Store the device in a dry, static-free environment to prevent damage.
    • Handle with care to avoid mechanical stress on the pins and package.
  9. Soldering:

    • Use appropriate soldering techniques and temperatures to avoid thermal damage to the device.
  10. Testing:

    • Before integrating the device into a larger system, test it individually to ensure it meets all specifications.
(For reference only)

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