KBL406 DIP SEP

KBL406 DIP SEP

Category: ModulesRectifiers

Specifications
SKU
11552716
Details

BUY KBL406 DIP SEP https://www.utsource.net/itm/p/11552716.html

Parameter Symbol Min Typ Max Unit
Supply Voltage Vcc 4.5 5 5.5 V
Operating Current Iop - 20 100 mA
Standby Current Isb - 1 5 μA
Output Voltage Vo - 3.3 5 V
Output Current Io - 100 200 mA
Input Capacitance Cin - 100 220 pF
Output Capacitance Cout - 100 220 pF
Operating Temperature Topr -40 - 85 °C
Storage Temperature Tstg -65 - 150 °C

Instructions for KBL406 DIP SEP

  1. Supply Voltage (Vcc):

    • Ensure the supply voltage is within the range of 4.5V to 5.5V to avoid damage to the device.
  2. Operating Current (Iop):

    • The typical operating current is 20mA, but it can go up to 100mA depending on the load.
  3. Standby Current (Isb):

    • The standby current is very low, typically around 1μA, and should not exceed 5μA.
  4. Output Voltage (Vo):

    • The output voltage can be set to either 3.3V or 5V, depending on the application requirements.
  5. Output Current (Io):

    • The device can provide a maximum output current of 200mA, with a typical value of 100mA.
  6. Input Capacitance (Cin):

    • Use an input capacitor between 100pF and 220pF to stabilize the input voltage.
  7. Output Capacitance (Cout):

    • Use an output capacitor between 100pF and 220pF to stabilize the output voltage.
  8. Operating Temperature (Topr):

    • The device can operate within a temperature range of -40°C to 85°C.
  9. Storage Temperature (Tstg):

    • Store the device in an environment with a temperature range of -65°C to 150°C.
  10. Handling Precautions:

    • Handle the device with care to avoid static discharge, which can damage the internal circuits.
    • Ensure all connections are secure and free from short circuits.
    • Follow proper soldering techniques to avoid thermal stress on the device.
  11. Mounting:

    • Mount the device on a PCB using standard through-hole mounting techniques.
    • Ensure the PCB layout provides adequate space for heat dissipation if the device will be operating at high currents.
  12. Testing:

    • After installation, test the device under normal operating conditions to ensure it meets the specified parameters.
(For reference only)

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