Details
BUY 2SC3281 https://www.utsource.net/itm/p/11552810.html
Parameter | Symbol | Min | Typ | Max | Unit |
---|---|---|---|---|---|
Collector-Emitter Voltage | VCE | - | - | 80 | V |
Collector-Base Voltage | VCB | - | - | 80 | V |
Emitter-Base Voltage | VEB | -5 | - | 5 | V |
Collector Current | IC | - | 15 | 15 | A |
Base Current | IB | - | 3 | 3 | A |
Power Dissipation | PT | - | - | 90 | W |
Junction Temperature | TJ | -55 | - | 150 | °C |
Storage Temperature | TSTG | -65 | - | 150 | °C |
Thermal Resistance | RθJC | - | - | 1.5 | °C/W |
Instructions for Use:
Mounting:
- Ensure proper heat sinking to maintain junction temperature within specified limits.
- Use a thermal compound between the transistor and the heat sink for better thermal conductivity.
Biasing:
- Set the base current (IB) to ensure the transistor operates in the desired region (saturation, active, or cutoff).
- Avoid exceeding the maximum base current to prevent damage.
Voltage Ratings:
- Do not exceed the maximum collector-emitter voltage (VCE) and collector-base voltage (VCB).
- Ensure the emitter-base voltage (VEB) remains within the specified range to avoid reverse breakdown.
Current Handling:
- The collector current (IC) should not exceed the maximum rating to prevent overheating and potential failure.
- Monitor the power dissipation (PT) to ensure it stays within the safe operating area.
Temperature Management:
- Keep the junction temperature (TJ) within the specified range to ensure reliable operation.
- Store the transistor in a controlled environment within the storage temperature range (TSTG).
Handling:
- Handle the transistor with care to avoid mechanical damage.
- Use appropriate ESD protection to prevent damage from static electricity.
Testing:
- Test the transistor parameters using a suitable test setup to ensure it meets the specifications.
- Verify the thermal resistance (RθJC) to ensure adequate cooling during operation.
View more about 2SC3281 on main site