Details

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BUY IXFH16N80P https://www.utsource.net/itm/p/11552838.html

Parameter	Symbol	Min	Typical	Max	Unit	Conditions
Drain-Source Voltage	VDS	-	800	-	V
Gate-Source Voltage	VGS	-20	-	20	V
Continuous Drain Current	ID	-	16	-	A	TC = 25掳C
Continuous Drain Current (TC = 75掳C)	ID(TC)	-	11.2	-	A	TC = 75掳C
Pulse Drain Current	IDM	-	50	-	A	tp = 10 渭s, IGT = 4 A
Total Power Dissipation	PTOT	-	200	-	W	TC = 25掳C
Junction Temperature	TJ	-	-	150	掳C
Storage Temperature Range	TSTG	-55	-	150	掳C
Thermal Resistance, Junction to Case	R胃JC	-	0.6	-	掳C/W
Gate Charge	QG	-	135	-	nC	VGS = 15 V, ID = 16 A
Input Capacitance	Ciss	-	1950	-	pF	VDS = 400 V, f = 1 MHz
Output Capacitance	Coss	-	165	-	pF	VDS = 400 V, f = 1 MHz
Reverse Transfer Capacitance	Crss	-	280	-	pF	VDS = 400 V, f = 1 MHz

Instructions for Use:

1. Handling Precautions:

   • Handle the device with care to avoid damage to the leads or the body.
   • Use proper ESD (Electrostatic Discharge) protection to prevent damage from static electricity.

2. Mounting:

   • Ensure that the device is securely mounted to a heatsink to manage heat dissipation effectively.
   • Use thermal compound between the device and the heatsink to improve thermal conductivity.

3. Biasing:

   • Apply the gate-source voltage (V_GS) within the specified limits to avoid damage to the gate.
   • Ensure that the drain-source voltage (V_DS) does not exceed the maximum rating.

4. Current Limiting:

   • Do not exceed the continuous drain current (I_D) ratings, especially at higher temperatures.
   • For pulse applications, ensure that the pulse duration and peak current do not exceed the specified limits.

5. Thermal Management:

   • Monitor the junction temperature (T_J) to ensure it stays within the safe operating range.
   • Use the thermal resistance (R_胃JC) data to design an effective cooling system.

6. Capacitance Considerations:

   • Account for the input capacitance (C_iss), output capacitance (C_oss), and reverse transfer capacitance (C_rss) in your circuit design to optimize performance.

7. Storage:

   • Store the device in a dry, cool place within the specified storage temperature range (T_STG).

8. Testing:

   • Before final assembly, test the device under controlled conditions to ensure it meets the required specifications.

(For reference only)