Details

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BUY FFPF10UP20STU F10UP20S TO-220F https://www.utsource.net/itm/p/11553288.html

Parameter	Symbol	Min	Typical	Max	Unit	Notes
Rated Voltage	VRMS	-	200	-	V	Continuous operating voltage
Peak Repetitive Reverse Voltage	VRRM	-	200	-	V	Maximum peak reverse voltage
Rated Forward Current	IF	-	10	-	A	Continuous forward current
Peak Surge Current	IFSM	-	100	-	A	Non-repetitive peak surge
Forward Voltage	VF	-	1.1	-	V	At IF = 10A
Reverse Recovery Time	trr	-	35	-	ns	At IF = 10A, IR = 1A
Junction Temperature	TJ	-	-	175	掳C	Maximum operating temperature
Storage Temperature	TSTG	-40	-	150	掳C	Storage and handling
Operating Temperature	TA	-55	-	150	掳C	Ambient temperature

Instructions for Use:

1. Mounting:

   • Ensure proper heat sinking to maintain junction temperature within specified limits.
   • Use a thermal interface material (TIM) between the device and the heat sink for optimal thermal performance.

2. Electrical Connections:

   • Connect the device according to the polarity markings on the package.
   • Ensure all connections are secure and free from mechanical stress.

3. Surge Handling:

   • The device is designed to handle non-repetitive peak surge currents up to 100A. Ensure that surge conditions do not exceed this limit to avoid damage.

4. Thermal Management:

   • Monitor the junction temperature to ensure it does not exceed 175掳C. Use appropriate cooling methods if necessary.

5. Storage:

   • Store the device in a dry environment with temperatures ranging from -40掳C to 150掳C to prevent degradation.

6. Handling:

   • Handle the device with care to avoid mechanical damage. Use ESD (Electrostatic Discharge) protection when handling to prevent damage from static electricity.

7. Soldering:

   • Follow recommended soldering profiles to avoid thermal shock and ensure reliable solder joints. Typically, a maximum soldering temperature of 260掳C for no more than 10 seconds is recommended.

8. Testing:

   • Perform regular testing to ensure the device is functioning within its specified parameters. Use appropriate test equipment and procedures to avoid damaging the device during testing.

(For reference only)