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IC HS MOSFET DRIVER SOT-23-5
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions |
|---|---|---|---|---|---|---|
| Input Voltage | VIN | 1.0 | - | 5.5 | V | |
| Continuous Output Current | IOUT | - | 4.0 | - | A | @ 25°C ambient |
| Peak Output Current | IPEAK | - | 6.0 | - | A | @ 25°C ambient |
| On-State Resistance | RON | - | 30 | - | mΩ | @ 25°C ambient, VIN = 3.3V |
| Off-State Leakage Current | ISD | - | 1 | - | μA | @ 25°C ambient, VIN = 5.5V |
| Power Dissipation | PD | - | - | 1.2 | W | @ 25°C ambient |
| Operating Temperature | TOPR | -40 | - | 85 | °C | |
| Storage Temperature | TSTG | -65 | - | 150 | °C |
Instructions for Use:
Power Supply:
- Ensure the input voltage (VIN) is within the specified range of 1.0V to 5.5V.
- The device can handle a continuous output current of up to 4.0A and peak currents up to 6.0A.
Thermal Management:
- The on-state resistance (RON) is typically 30mΩ at 25°C ambient temperature and 3.3V input voltage. Ensure proper heat dissipation to maintain the device within its operating temperature range (-40°C to 85°C).
- The power dissipation (PD) should not exceed 1.2W to avoid overheating.
Leakage Current:
- The off-state leakage current (ISD) is typically 1μA at 25°C ambient temperature and 5.5V input voltage. This should be considered when designing circuits that require low standby power consumption.
Environmental Conditions:
- Store the device in a temperature range of -65°C to 150°C to ensure long-term reliability.
Circuit Design:
- Place the device close to the load to minimize parasitic inductance and improve transient response.
- Use appropriate decoupling capacitors near the input and output pins to filter noise and stabilize the power supply.
Handling:
- Handle the device with care to avoid static discharge, which can damage the internal components.
- Follow standard ESD (Electrostatic Discharge) precautions during assembly and testing.
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