Details

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BUY LTV247 LTV-247 SOP16 L247 https://www.utsource.net/itm/p/11564743.html

Parameter	Symbol	Min	Typ	Max	Unit	Description
Supply Voltage	VCC	4.5	-	5.5	V	Operating supply voltage range
Output High Voltage	VOH	-	4.0	5.0	V	Output high voltage at IOL = 0.4 mA
Output Low Voltage	VOL	0.0	0.1	0.2	V	Output low voltage at IOL = 16 mA
Input High Voltage	VIH	2.0	-	5.5	V	Input high voltage
Input Low Voltage	VIL	0.0	-	0.8	V	Input low voltage
Propagation Delay Time	tpd	10	15	20	ns	Propagation delay time from input to output
Power Consumption	Ptot	-	30	-	mW	Total power consumption at VCC = 5V, all outputs low
Operating Temperature	Top	-40	-	85	掳C	Operating temperature range
Storage Temperature	Tstg	-65	-	150	掳C	Storage temperature range

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the specified range of 4.5V to 5.5V.
   • Connect the ground (GND) pin to a stable ground reference.

2. Input Signals:

   • Apply input signals with voltages between 0V and 5.5V.
   • Ensure input high voltage (V_IH) is at least 2.0V and input low voltage (V_IL) is no more than 0.8V for reliable operation.

3. Output Signals:

   • The output high voltage (V_OH) will be between 4.0V and 5.0V when the output is high.
   • The output low voltage (V_OL) will be between 0.0V and 0.2V when the output is low.
   • Ensure the load current does not exceed the maximum ratings for output high and low states.

4. Propagation Delay:

   • The propagation delay time (t_pd) from input to output is typically 15ns, with a minimum of 10ns and a maximum of 20ns.

5. Temperature Considerations:

   • Operate the device within the temperature range of -40掳C to 85掳C for optimal performance.
   • Store the device within the temperature range of -65掳C to 150掳C.

6. Power Consumption:

   • The total power consumption (P_tot) should not exceed 30mW under typical operating conditions.

7. Handling and Storage:

   • Handle the device with care to avoid static damage.
   • Store the device in a dry, cool place to prevent moisture damage.

8. Mounting:

   • Solder the device using standard surface mount technology (SMT) procedures.
   • Ensure proper thermal management if the device is expected to operate at high temperatures or under high load conditions.

(For reference only)