Details
BUY IXTP60N10T https://www.utsource.net/itm/p/11565456.html
Parameter | Symbol | Min | Typ | Max | Unit | Notes |
---|---|---|---|---|---|---|
Collector-Emitter Voltage | VCEO | - | - | 1000 | V | |
Emitter-Collector Voltage | VECS | - | - | 1000 | V | |
Gate-Emitter Voltage | VGE | -15 | - | 20 | V | |
Continuous Collector Current | IC | - | 60 | - | A | |
Pulse Collector Current | IC(pulse) | - | 180 | - | A | tp = 10 渭s, IGC = 10 A |
Power Dissipation | PTOT | - | - | 300 | W | TC = 25掳C |
Junction Temperature | TJ | - | - | 175 | 掳C | |
Storage Temperature | TSTG | -55 | - | 150 | 掳C |
Instructions for Use:
Mounting:
- Ensure proper heat sinking to maintain junction temperature within safe limits.
- Use a thermal compound between the transistor and the heat sink for better thermal conductivity.
Biasing:
- Apply gate-emitter voltage (VGE) within the specified range to avoid damage.
- Ensure that the gate resistor is appropriate to limit current and prevent oscillations.
Current Handling:
- Do not exceed the continuous collector current (IC) rating.
- For pulse applications, ensure that the pulse width and frequency do not exceed the specified limits.
Voltage Ratings:
- Do not exceed the maximum collector-emitter voltage (VCEO) or emitter-collector voltage (VECS).
- Ensure that the gate-emitter voltage (VGE) is within the specified range to avoid gate damage.
Thermal Management:
- Monitor the junction temperature (TJ) to ensure it does not exceed 175掳C.
- Store the device in a temperature-controlled environment to prevent damage from extreme temperatures.
Handling:
- Handle with care to avoid mechanical stress.
- Use appropriate ESD protection to prevent damage from static electricity.
Testing:
- Perform initial testing at low power levels to verify correct operation.
- Regularly inspect the device for signs of wear or damage.
By following these guidelines, you can ensure reliable and efficient operation of the IXTP60N10T transistor.
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