Details
BUY IXFH24N90P https://www.utsource.net/itm/p/11603784.html
Parameter | Symbol | Min | Typical | Max | Unit | Conditions |
---|---|---|---|---|---|---|
Drain-Source Voltage | VDS | - | - | 900 | V | - |
Gate-Source Voltage | VGS | -15 | - | 20 | V | - |
Continuous Drain Current | ID | - | 24 | - | A | TC = 25掳C |
Pulse Drain Current | IDpeak | - | 72 | - | A | tp = 10 渭s, IG = 3 A |
Power Dissipation | PTOT | - | - | 180 | W | TC = 25掳C |
Junction Temperature | TJ | - | - | 175 | 掳C | - |
Storage Temperature | TSTG | -55 | - | 150 | 掳C | - |
Thermal Resistance (Junction to Case) | RthJC | - | 0.46 | - | 掳C/W | - |
Input Capacitance | Ciss | - | 2200 | - | pF | VDS = 450 V, f = 1 MHz |
Output Capacitance | Coss | - | 110 | - | pF | VDS = 450 V, f = 1 MHz |
Reverse Transfer Capacitance | Crss | - | 380 | - | pF | VDS = 450 V, f = 1 MHz |
Gate Charge | QG | - | 70 | - | nC | VGS = 15 V, ID = 15 A |
Turn-on Delay Time | td(on) | - | 25 | - | ns | VGS = 15 V, ID = 15 A, RG = 2 惟 |
Rise Time | tr | - | 35 | - | ns | VGS = 15 V, ID = 15 A, RG = 2 惟 |
Turn-off Delay Time | td(off) | - | 25 | - | ns | VGS = 15 V, ID = 15 A, RG = 2 惟 |
Fall Time | tf | - | 35 | - | ns | VGS = 15 V, ID = 15 A, RG = 2 惟 |
Instructions for Use:
Handling Precautions:
- Handle the device with care to avoid damage to the leads and body.
- Use appropriate ESD protection to prevent damage from static electricity.
Mounting:
- Ensure proper heat sinking to manage the power dissipation and maintain the junction temperature within safe limits.
- Use a thermal interface material (TIM) between the device and the heatsink to improve thermal performance.
Biasing:
- Apply the gate-source voltage (VGS) within the specified range to ensure reliable operation.
- Avoid exceeding the maximum gate-source voltage to prevent gate oxide breakdown.
Current Handling:
- Do not exceed the continuous drain current (ID) or pulse drain current (IDpeak) ratings.
- For pulse applications, ensure that the pulse duration and frequency are within the specified limits.
Thermal Management:
- Monitor the junction temperature (TJ) to ensure it does not exceed the maximum rating.
- Use the thermal resistance (RthJC) to calculate the required heatsink size and cooling method.
Capacitance Considerations:
- Account for the input capacitance (Ciss), output capacitance (Coss), and reverse transfer capacitance (Crss) in circuit design to optimize performance and minimize switching losses.
Gate Drive:
- Use a gate resistor (RG) to control the turn-on and turn-off times, which can help reduce switching losses and electromagnetic interference (EMI).
Storage:
- Store the device in a dry, cool place within the specified storage temperature range to prevent damage.
By following these guidelines, you can ensure the reliable and efficient operation of the IXFH24N90P MOSFET.
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