IXFH24N90P

IXFH24N90P

Category: Transistors

Specifications
SKU
11603784
Details

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Parameter Symbol Min Typical Max Unit Conditions
Drain-Source Voltage VDS - - 900 V -
Gate-Source Voltage VGS -15 - 20 V -
Continuous Drain Current ID - 24 - A TC = 25掳C
Pulse Drain Current IDpeak - 72 - A tp = 10 渭s, IG = 3 A
Power Dissipation PTOT - - 180 W TC = 25掳C
Junction Temperature TJ - - 175 掳C -
Storage Temperature TSTG -55 - 150 掳C -
Thermal Resistance (Junction to Case) RthJC - 0.46 - 掳C/W -
Input Capacitance Ciss - 2200 - pF VDS = 450 V, f = 1 MHz
Output Capacitance Coss - 110 - pF VDS = 450 V, f = 1 MHz
Reverse Transfer Capacitance Crss - 380 - pF VDS = 450 V, f = 1 MHz
Gate Charge QG - 70 - nC VGS = 15 V, ID = 15 A
Turn-on Delay Time td(on) - 25 - ns VGS = 15 V, ID = 15 A, RG = 2 惟
Rise Time tr - 35 - ns VGS = 15 V, ID = 15 A, RG = 2 惟
Turn-off Delay Time td(off) - 25 - ns VGS = 15 V, ID = 15 A, RG = 2 惟
Fall Time tf - 35 - ns VGS = 15 V, ID = 15 A, RG = 2 惟

Instructions for Use:

  1. Handling Precautions:

    • Handle the device with care to avoid damage to the leads and body.
    • Use appropriate ESD protection to prevent damage from static electricity.
  2. Mounting:

    • Ensure proper heat sinking to manage the power dissipation and maintain the junction temperature within safe limits.
    • Use a thermal interface material (TIM) between the device and the heatsink to improve thermal performance.
  3. Biasing:

    • Apply the gate-source voltage (VGS) within the specified range to ensure reliable operation.
    • Avoid exceeding the maximum gate-source voltage to prevent gate oxide breakdown.
  4. Current Handling:

    • Do not exceed the continuous drain current (ID) or pulse drain current (IDpeak) ratings.
    • For pulse applications, ensure that the pulse duration and frequency are within the specified limits.
  5. Thermal Management:

    • Monitor the junction temperature (TJ) to ensure it does not exceed the maximum rating.
    • Use the thermal resistance (RthJC) to calculate the required heatsink size and cooling method.
  6. Capacitance Considerations:

    • Account for the input capacitance (Ciss), output capacitance (Coss), and reverse transfer capacitance (Crss) in circuit design to optimize performance and minimize switching losses.
  7. Gate Drive:

    • Use a gate resistor (RG) to control the turn-on and turn-off times, which can help reduce switching losses and electromagnetic interference (EMI).
  8. Storage:

    • Store the device in a dry, cool place within the specified storage temperature range to prevent damage.

By following these guidelines, you can ensure the reliable and efficient operation of the IXFH24N90P MOSFET.

(For reference only)

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