Details

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BUY H11L1 DIP6 H11L1M https://www.utsource.net/itm/p/11603799.html

Parameter	Description	Value
Package Type	Housing Style	DIP-6
Input Device	Type	Photodiode
Output Device	Type	Phototransistor (NPN)
Isolation Voltage	VIO	5300 VRMS
Forward Current	IF	20 mA (Max)
Peak Forward Surge Current	IFSM	1 A (10 ms, single pulse)
Reverse Voltage	VRR	5 V (Max)
Collector-Emitter Voltage	VCEO	30 V (Max)
Collector Current	IC	100 mA (Max)
Operating Temperature	TA	-40掳C to 85掳C
Storage Temperature	TSTG	-40掳C to 125掳C
CTR (Current Transfer Ratio)	Min to Max	20% to 400%
Response Time	tr and tf	10 渭s (Typ)
Power Dissipation	PD	150 mW (Max)

Instructions for Use:

1. Mounting:

   • Ensure the device is mounted on a PCB with proper clearance to avoid short circuits.
   • Follow the recommended footprint and soldering profile for DIP-6 packages.

2. Electrical Connections:

   • Connect the photodiode (input side) to the appropriate drive circuit, ensuring the forward current does not exceed 20 mA.
   • Connect the phototransistor (output side) to the load circuit, ensuring the collector-emitter voltage and collector current do not exceed their maximum ratings.

3. Isolation:

   • The device provides electrical isolation up to 5300 V_RMS. Ensure that the input and output circuits are designed to maintain this isolation.

4. Temperature Considerations:

   • Operate the device within the specified temperature range (-40掳C to 85掳C) to ensure reliable performance.
   • Store the device in an environment within the storage temperature range (-40掳C to 125掳C).

5. CTR (Current Transfer Ratio):

   • The CTR can vary widely (20% to 400%). Design the circuit to accommodate this range for consistent operation.

6. Response Time:

   • The typical response time is 10 渭s. Ensure the application can handle this delay if high-speed switching is required.

7. Power Dissipation:

   • Do not exceed the maximum power dissipation of 150 mW to prevent overheating and potential damage to the device.

8. Handling:

   • Handle the device with care to avoid mechanical stress or damage to the leads.
   • Use anti-static precautions to prevent damage from electrostatic discharge (ESD).

(For reference only)