THGBMNG5D1LBAIT

THGBMNG5D1LBAIT

Category: IC Chips

Specifications
SKU
11609866
Details

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EMMC
Parameter Value
Product Name THGBMNG5D1LBAIT
Type NAND Flash Memory
Capacity 512 Gb (64 GB)
Interface Toggle Mode 2.0
Package BGA (Ball Grid Array)
Form Factor 16x20 mm
Voltage (Vcc) 1.8 V ± 0.1 V
Operating Temperature -40°C to +85°C
Data Retention 10 years at 25°C
ECC Requirement 24 bits per 1024 bytes
Read Performance Up to 400 MB/s
Write Performance Up to 200 MB/s
Endurance 3,000 Program/Erase Cycles
RoHS Compliance Yes

Instructions for Use

  1. Power Supply:

    • Ensure that the supply voltage (Vcc) is within the specified range of 1.8 V ± 0.1 V.
    • Use a stable power source to avoid fluctuations that could cause data corruption or damage to the device.
  2. Signal Integrity:

    • Use proper PCB layout techniques to minimize signal reflections and crosstalk.
    • Place decoupling capacitors close to the power pins to filter out noise.
  3. Initialization:

    • Follow the initialization sequence as outlined in the datasheet to ensure the device is properly configured before use.
    • Set the appropriate mode and configuration registers according to your application requirements.
  4. Command and Address Timing:

    • Adhere to the timing parameters provided in the datasheet to ensure reliable operation.
    • Pay special attention to setup and hold times for commands and addresses.
  5. Error Correction Code (ECC):

    • Implement an ECC algorithm capable of correcting up to 24 bits per 1024 bytes to maintain data integrity.
    • Ensure that the ECC engine is correctly integrated with the memory controller.
  6. Programming and Erasing:

    • Follow the recommended programming and erasing procedures to prevent overwriting data and to maximize the lifespan of the device.
    • Limit the number of program/erase cycles to within the specified endurance limit.
  7. Thermal Management:

    • Ensure adequate cooling to keep the operating temperature within the specified range.
    • Use thermal vias and heat sinks if necessary to dissipate heat effectively.
  8. Handling and Storage:

    • Handle the device with care to avoid physical damage.
    • Store the device in a dry, static-free environment to prevent moisture and electrostatic discharge (ESD) damage.
  9. Testing and Validation:

    • Perform thorough testing and validation to ensure the device meets the performance and reliability requirements of your application.
    • Use diagnostic tools and test patterns to verify correct operation.

For more detailed information, refer to the datasheet and application notes provided by the manufacturer.

(For reference only)

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