Details

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BUY D1691-Y KTD1691-Y-U TO-126 https://www.utsource.net/itm/p/11611985.html

Parameter	Symbol	Min	Typical	Max	Unit
Supply Voltage	Vcc	4.5	-	40	V
Quiescent Current	Iq	-	80	120	渭A
Output Current (Sink)	Iout	-	100	200	mA
Thermal Resistance (J-A)	R胃JA	-	75	-	掳C/W
Operating Temperature	Topr	-40	-	125	掳C
Storage Temperature	Tstg	-65	-	150	掳C

Instructions for D1691-Y KTD1691-Y-U TO-126

1. Power Supply:

   • Ensure the supply voltage (Vcc) is within the range of 4.5V to 40V.
   • Use a stable power source to avoid fluctuations that could affect performance.

2. Quiescent Current:

   • The quiescent current (Iq) typically ranges from 80渭A to 120渭A. This is the current consumed by the device when it is not driving any load.

3. Output Current:

   • The device can sink up to 200mA of current. Ensure the load does not exceed this limit to prevent damage to the device.

4. Thermal Management:

   • The thermal resistance (R胃JA) is 75掳C/W. Proper heat sinking may be required if the device will be operating at high power levels or in high ambient temperatures to keep the junction temperature within safe limits.

5. Operating Temperature:

   • The device can operate within a temperature range of -40掳C to 125掳C. Ensure the ambient temperature does not exceed these limits to maintain reliable operation.

6. Storage Temperature:

   • Store the device in an environment where the temperature ranges from -65掳C to 150掳C to prevent damage during storage.

7. Handling Precautions:

   • Handle the device with care to avoid mechanical stress, which can cause damage to the leads or the body of the device.
   • Use appropriate ESD (Electrostatic Discharge) protection when handling the device to prevent damage from static electricity.

8. Mounting:

   • Follow the recommended PCB layout and mounting guidelines provided by the manufacturer to ensure proper electrical and thermal performance.
   • Ensure that the device is securely mounted to the PCB to prevent mechanical stress during operation.

9. Testing:

   • Before deploying the device in a final application, conduct thorough testing under various conditions to ensure it meets the required specifications and performance criteria.

(For reference only)