Details

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BUY XC95288XL-10PQ208C https://www.utsource.net/itm/p/11614191.html
IC CPLD 288 MCELL C-TEMP 208PQFP

Parameter	Description	Value
Device Type	High-Density, Non-Volatile CPLD	XC95288XL
Package	Plastic Quad Flatpack (PQFP)	208-Pin
Speed Grade	Maximum Frequency	-10 (10 ns)
Supply Voltage (VCC)	Operating Voltage	3.3V ± 5%
I/O Voltage	Input/Output Voltage Range	3.3V ± 5%
Configuration Memory	Non-Volatile Flash Memory	288 Macrocells
I/O Pins	Number of I/O Pins	168
Logic Cells	Number of Logic Cells	288
Power Consumption	Typical Power Consumption (Active)	100 mW
Operating Temperature	Commercial (C)	0°C to 70°C
Storage Temperature	Storage Temperature Range	-65°C to 150°C
Programming Voltage	Programming Voltage (VPP)	12.0V ± 5%
Programming Time	Typical Programming Time	10 ms
ESD Protection	Human Body Model (HBM)	2000 V
Lead Finish	Lead Finish	Tin
RoHS Compliance	RoHS Compliant	Yes

Instructions for Use

1. Power Supply:

   • Ensure the supply voltage (VCC) is set to 3.3V ± 5%.
   • Connect the ground (GND) pin to a stable ground reference.

2. Configuration:

   • Use a compatible programmer to configure the device using the JTAG or ISP (In-System Programming) interface.
   • Verify the programming settings to ensure the correct speed grade (-10) and configuration file are used.

3. I/O Handling:

   • Apply input voltages within the specified range of 3.3V ± 5%.
   • Ensure that all unused I/O pins are either pulled high or low to avoid floating states.

4. Temperature Considerations:

   • Operate the device within the commercial temperature range of 0°C to 70°C.
   • Store the device in an environment with a temperature range of -65°C to 150°C.

5. ESD Protection:

   • Handle the device with ESD protection measures to prevent damage from static electricity.
   • Use grounded wrist straps and ESD-safe workstations.

6. Mounting:

   • Solder the device onto the PCB using a reflow soldering process suitable for the PQ208 package.
   • Ensure proper alignment and adequate cooling during the soldering process to prevent thermal damage.

7. Testing:

   • After mounting, perform initial testing to verify the correct operation of the device.
   • Use boundary scan (JTAG) to test the interconnects and functionality of the device on the board.

8. Documentation:

   • Refer to the datasheet and application notes provided by Xilinx for detailed information on device-specific features and advanced configurations.

(For reference only)