Details

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BUY FB52N15D https://www.utsource.net/itm/p/11617647.html

Parameter	Symbol	Min	Typ	Max	Unit	Description
Forward Voltage	VF	-	1.5	2.0	V	Voltage drop across the diode when forward biased at IF = 20 mA
Reverse Current	IR	-	-	100	nA	Leakage current at VR = 50 V, Ta = 25掳C
Peak Reverse Voltage	VRRM	-	-	50	V	Maximum reverse voltage that can be applied continuously
Operating Temperature Range	TOP	-40	-	85	掳C	Temperature range for normal operation
Storage Temperature Range	TSTG	-65	-	150	掳C	Temperature range for storage
Forward Current (Continuous)	IF	-	20	-	mA	Continuous forward current at Ta = 25掳C
Forward Current (Pulse)	IF(SM)	-	300	-	mA	Non-repetitive peak forward surge current, tp = 10 ms, Ta = 25掳C
Junction Capacitance	CJ	-	10	-	pF	Capacitance at VR = 0 V, f = 1 MHz, Ta = 25掳C
Reverse Recovery Time	trr	-	15	-	ns	Time taken for the diode to recover from reverse breakdown, IF = 20 mA, IR = 100 nA

Instructions:

1. Forward Biasing:

   • Ensure the forward voltage (V_F) is within the specified range to avoid excessive power dissipation.
   • The continuous forward current (I_F) should not exceed 20 mA at room temperature (25掳C).

2. Reverse Biasing:

   • The peak reverse voltage (V_RRM) must not exceed 50 V to prevent damage to the diode.
   • Monitor the reverse current (I_R) to ensure it stays below 100 nA to avoid overheating.

3. Temperature Considerations:

   • Operate the diode within the operating temperature range (T_OP) of -40掳C to 85掳C.
   • Store the diode within the storage temperature range (T_STG) of -65掳C to 150掳C.

4. Surge Current:

   • For non-repetitive surge conditions, the peak forward surge current (I_F(SM)) can be up to 300 mA for a pulse duration of 10 ms at room temperature (25掳C).

5. Capacitance and Recovery:

   • The junction capacitance (C_J) is approximately 10 pF, which affects high-frequency performance.
   • The reverse recovery time (t_rr) is about 15 ns, which is important for switching applications.

6. Mounting and Handling:

   • Handle the diode with care to avoid mechanical stress and electrostatic discharge (ESD).
   • Follow recommended soldering profiles to ensure reliable connections without damaging the component.

(For reference only)