Details

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BUY LMX339AUD+T https://www.utsource.net/itm/p/11620792.html
IC COMPARATOR GP QUAD 14TSSOP

Parameter	Symbol	Min	Typical	Max	Unit	Description
Supply Voltage	Vcc	2.7	5.0	5.5	V	Operating supply voltage range
Quiescent Current	IQ	-	1.6	-	mA	Supply current at no load
Output Current (Per LED)	ILED	-	20	-	mA	Maximum output current per channel
Channel-to-Channel Match	ΔILED	-	1.0	-	%	Maximum deviation in output current between channels
Thermal Resistance	θJA	-	150	-	°C/W	Junction-to-ambient thermal resistance
Operating Temperature	Toper	-40	-	85	°C	Operating temperature range
Storage Temperature	Tstg	-65	-	150	°C	Storage temperature range
ESD Rating	HBM	-	2000	-	V	Human Body Model (HBM) ESD rating

Instructions for Use

1. Supply Voltage:

   • Ensure the supply voltage is within the range of 2.7V to 5.5V. The typical operating voltage is 5.0V.

2. Quiescent Current:

   • The quiescent current is typically 1.6mA. This is the current drawn by the device when no load is connected.

3. Output Current:

   • Each channel can drive up to 20mA of current. Ensure that the load (e.g., LEDs) does not exceed this limit to avoid damage.

4. Channel-to-Channel Match:

   • The maximum deviation in output current between channels is 1.0%. This ensures consistent brightness across multiple LEDs.

5. Thermal Management:

   • The junction-to-ambient thermal resistance is 150°C/W. Ensure proper heat dissipation, especially in high-power applications, to prevent overheating.

6. Operating Temperature:

   • The device operates reliably from -40°C to 85°C. Avoid exposing the device to temperatures outside this range.

7. Storage Temperature:

   • Store the device in an environment with temperatures ranging from -65°C to 150°C to ensure long-term reliability.

8. ESD Protection:

   • The device has an ESD rating of 2000V under the Human Body Model (HBM). Handle the device with care to avoid electrostatic discharge damage.

9. Soldering:

   • Use a soldering iron with a temperature setting appropriate for surface-mount components. Follow standard soldering guidelines to avoid thermal shock.

10. Layout Considerations:

    • Place the device close to the power supply and ground planes to minimize noise and improve stability. Use short, wide traces for power and ground connections.

11. Testing:

    • After assembly, test the device under normal operating conditions to ensure it meets the specified performance parameters.

By following these guidelines, you can ensure optimal performance and reliability of the LMX339AUD+T in your application.

(For reference only)