Details

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BUY EPF10K10QC208-3 https://www.utsource.net/itm/p/11622792.html
IC FPGA 134 I/O 208QFP

Parameter	Description	Value
Device Type	Family of the device	Cyclone I
Device	Specific device model	EPF10K10QC208-3
Package	Package type	208-pin Quad Flatpack (QFP)
Speed Grade	Speed grade of the device	-3
Logic Cells	Number of logic cells available	10,000
I/O Pins	Number of input/output pins	144
Internal RAM	Amount of internal RAM available	128 Kbits
Multiplier Blocks	Number of multiplier blocks available	8
PLLs	Number of Phase-Locked Loops available	2
Maximum Clock Frequency	Maximum clock frequency supported	266 MHz
Power Supply Voltage	Operating voltage range	3.3V
Standby Current	Current consumption in standby mode	10 μA
Operating Temperature	Range of operating temperatures	-40°C to +85°C
Configuration Memory	Configuration memory type	Flash
Configuration Time	Time required for configuration	10 ms
JTAG Boundary Scan	JTAG boundary scan support	Yes
ESD Protection	Electrostatic discharge protection	±2000 V HBM

Instructions for Use

1. Power Supply:

   • Ensure that the device is powered with a stable 3.3V supply.
   • Connect the VCC and GND pins as specified in the datasheet.

2. Configuration:

   • Use a JTAG programmer or an Active Serial/Parallel configuration method to load the configuration file into the device.
   • Ensure the configuration file is compatible with the EPF10K10QC208-3 device.

3. Clocking:

   • Connect the external clock source to the appropriate clock input pin.
   • Ensure the clock signal meets the timing requirements specified in the datasheet.

4. Input/Output:

   • Configure the I/O pins as inputs or outputs based on your application requirements.
   • Use pull-up or pull-down resistors if necessary to ensure proper signal levels.

5. Testing:

   • After configuration, test the device to ensure it operates correctly.
   • Use boundary scan (JTAG) for testing and debugging if needed.

6. Thermal Management:

   • Ensure adequate cooling if the device will be operating at high frequencies or in high-temperature environments.
   • Refer to the thermal management guidelines in the datasheet for specific recommendations.

7. Handling:

   • Handle the device with care to avoid ESD damage.
   • Store the device in ESD-protected packaging when not in use.

8. Documentation:

   • Refer to the device datasheet and user manual for detailed information on pinout, timing diagrams, and other technical specifications.

(For reference only)