SN74LVC1G332DBVR

SN74LVC1G332DBVR


Specifications
SKU
11624828
Details

BUY SN74LVC1G332DBVR https://www.utsource.net/itm/p/11624828.html
IC GATE OR 1CH 3-INP SOT23-6
Parameter Description Min Typ Max Unit
VCC Supply Voltage 1.65 - 5.5 V
ICC Supply Current (Quiescent) - 1 - μA
VIH Input High Voltage 0.7 × VCC - VCC V
VIL Input Low Voltage 0 - 0.3 × VCC V
VOH Output High Voltage 0.9 × VCC - VCC - 0.1 V
VOL Output Low Voltage 0 - 0.1 V
IOH Output High Current - - -4 mA
IOL Output Low Current -16 - - mA
tpd Propagation Delay Time - 4.8 - ns
tphl High-to-Low Propagation Delay - 4.8 - ns
tplh Low-to-High Propagation Delay - 4.8 - ns
tskew Skew - 0.5 - ns
tcc Clock-to-Output Change - - - ns
Operating Temperature Range - -40 - 125 °C
Storage Temperature Range - -65 - 150 °C

Instructions for Using SN74LVC1G332DBVR

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the range of 1.65V to 5.5V.
    • Connect the VCC pin to the positive power supply and GND pin to the ground.
  2. Input Signals:

    • Apply input signals (VIH and VIL) that meet the specified voltage levels.
    • For high input, the voltage should be at least 0.7 × VCC.
    • For low input, the voltage should be no more than 0.3 × VCC.
  3. Output Signals:

    • The output high voltage (VOH) will be at least 0.9 × VCC when the output is high.
    • The output low voltage (VOL) will be no more than 0.1V when the output is low.
    • Ensure the output current (IOH and IOL) does not exceed the maximum ratings.
  4. Timing Parameters:

    • Check the propagation delay times (tpd, tphl, tplh) to ensure proper timing in your circuit.
    • Consider the skew (tskew) if multiple devices are used in parallel.
  5. Temperature Considerations:

    • Operate the device within the specified operating temperature range (-40°C to 125°C).
    • Store the device within the storage temperature range (-65°C to 150°C).
  6. Handling and ESD Protection:

    • Handle the device with care to avoid electrostatic discharge (ESD).
    • Use appropriate ESD protection measures during handling and assembly.
  7. Mounting and Soldering:

    • Follow recommended soldering profiles and temperatures to ensure reliable connections.
    • Avoid excessive heat and mechanical stress during mounting.
  8. Testing and Validation:

    • Test the device in a controlled environment to ensure it meets the required specifications.
    • Validate the performance under actual operating conditions.

By following these instructions, you can ensure optimal performance and reliability of the SN74LVC1G332DBVR in your application.

(For reference only)

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