MBR20200CFH

MBR20200CFH

Category: Transistors

Specifications
SKU
11632203
Details

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Parameter Symbol Min Typical Max Unit
Average Rectified Current IF(AV) - 20 - A
Peak Repetitive Reverse Voltage VRRM - 200 - V
Maximum RMS Voltage VRMS - 141 - V
Non-repetitive Surge Current (8.3/20渭s) IFSM - 300 - A
Junction Temperature TJ -55 - 175 掳C
Storage Temperature TSTG -65 - 150 掳C
Operating Temperature TOPR -55 - 150 掳C
Thermal Resistance, Junction to Case R胃JC - 2.0 - 掳C/W
Forward Voltage Drop at IF = 1A VF - 0.95 - V
Reverse Leakage Current at VR = 150V, TJ = 25掳C IR - 10 - 渭A

Instructions for Using MBR20200CFH:

  1. Handling Precautions:

    • ESD Protection: Handle the device with ESD-protected equipment to avoid damage.
    • Temperature Management: Ensure that the junction temperature does not exceed 175掳C during operation.
    • Storage Conditions: Store the device in a dry environment within the temperature range of -65掳C to 150掳C.
  2. Mounting and Soldering:

    • Soldering Temperature: Use a soldering iron with a maximum temperature of 260掳C for no more than 10 seconds.
    • Thermal Shock: Avoid subjecting the device to rapid temperature changes to prevent thermal shock.
  3. Electrical Connections:

    • Polarity: Ensure correct polarity when connecting the diode to the circuit. The cathode is marked on the device.
    • Current Limiting: Use appropriate current-limiting resistors or other components to ensure the average rectified current does not exceed 20A.
  4. Surge Current Handling:

    • Non-Repetitive Surge Current: The device can handle a non-repetitive surge current of up to 300A for a pulse width of 8.3/20渭s. Ensure that the surge current does not exceed this limit to avoid damage.
  5. Thermal Management:

    • Heat Sinking: For high-power applications, use a heat sink to dissipate heat effectively and maintain the junction temperature within safe limits.
    • Thermal Resistance: The thermal resistance from the junction to the case is 2.0掳C/W. Design the heat sink accordingly to manage the thermal load.
  6. Testing and Verification:

    • Forward Voltage Drop: Measure the forward voltage drop (VF) at a current of 1A to ensure it is within the specified range of 0.95V.
    • Reverse Leakage Current: Verify the reverse leakage current (IR) at a reverse voltage of 150V and a junction temperature of 25掳C to ensure it does not exceed 10渭A.
  7. Compliance and Standards:

    • RoHS Compliance: Ensure that the device complies with RoHS (Restriction of Hazardous Substances) standards if required for your application.
    • Safety Standards: Adhere to relevant safety standards and regulations for the specific application of the diode.

By following these guidelines, you can ensure the reliable and efficient operation of the MBR20200CFH diode in your electronic circuits.

(For reference only)

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