SN74HCT139N

SN74HCT139N

Category: IC Chips

Specifications
SKU
11646196
Details

BUY SN74HCT139N https://www.utsource.net/itm/p/11646196.html
IC DUAL 2TO4 DECOD/DEMUX 16-DIP
Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage VCC Operating 2.0 - 6.0 V
Input Low Voltage VIL - 0.0 - 0.8 V
Input High Voltage VIH - 2.0 - VCC V
Output Low Voltage VOL IOL = 4 mA 0.0 - 0.4 V
Output High Voltage VOH IOH = -0.4 mA 2.4 - VCC V
Input Current (Low) IIL VIL = 0 V -1.0 - -0.1 μA
Input Current (High) IIH VIH = VCC -20 - 20 μA
Output Current (Sink) IOL VOL = 0.4 V -8 - -4 mA
Output Current (Source) IOH VOH = VCC - 0.4 V 4 - 8 mA
Propagation Delay Time tpd VCC = 5 V, TA = 25°C - 10 22 ns
Power Dissipation PD Maximum at TA = 25°C - - 100 mW

Instructions for Using SN74HCT139N

  1. Supply Voltage:

    • Ensure the supply voltage (VCC) is within the range of 2.0 V to 6.0 V.
    • Connect the VCC pin to the positive power supply and GND pin to ground.
  2. Input Signals:

    • Apply input signals within the specified voltage ranges:
      • Low input (VIL): 0.0 V to 0.8 V
      • High input (VIH): 2.0 V to VCC
    • Ensure input currents do not exceed the specified limits:
      • Low input current (IIL): -1.0 μA to -0.1 μA
      • High input current (IIH): -20 μA to 20 μA
  3. Output Signals:

    • The output low voltage (VOL) should be 0.0 V to 0.4 V when sinking up to 4 mA.
    • The output high voltage (VOH) should be 2.4 V to VCC when sourcing up to 0.4 mA.
    • Ensure output currents do not exceed the specified limits:
      • Sink current (IOL): -8 mA to -4 mA
      • Source current (IOH): 4 mA to 8 mA
  4. Propagation Delay:

    • The propagation delay time (tpd) is typically 10 ns with a maximum of 22 ns at VCC = 5 V and TA = 25°C.
  5. Power Dissipation:

    • The maximum power dissipation (PD) is 100 mW at TA = 25°C. Ensure proper heat dissipation if operating near this limit.
  6. Handling:

    • Handle the device with care to avoid static damage. Use proper ESD protection measures.
    • Follow standard PCB layout guidelines to ensure reliable operation and minimize noise.
  7. Storage:

    • Store the device in a dry environment to prevent moisture damage.
    • Keep the device in its original packaging until ready for use.
(For reference only)

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