Details

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BUY RD01MUS2-T513 https://www.utsource.net/itm/p/11649501.html
Silicon RF Devices RF High Power MOS FETs (Discrete) RD01MUS2 Remarks RoHS : Restriction of the use of certain Hazardous Substances in Electrical and Electronic Equipment

Parameter	Description	Value
Part Number	Full part number	RD01MUS2-T513
Type	Device type	MOSFET
Technology	Type of technology	Silicon
Package	Package type	TO-252 (DPAK)
Polarity	Polarity of the MOSFET	N-Channel
VDS	Drain-to-Source Voltage	60 V
VGS	Gate-to-Source Voltage	±20 V
ID	Continuous Drain Current	4.2 A
RDS(on)	On-State Resistance at VGS=10V	55 mΩ
Power Dissipation	Maximum Power Dissipation	2.1 W
Operating Temp.	Operating Temperature Range	-55°C to +150°C
Storage Temp.	Storage Temperature Range	-65°C to +150°C
Gate Charge	Total Gate Charge	18 nC
Input Capacitance	Input Capacitance at VDS=10V	180 pF
Output Capacitance	Output Capacitance at VDS=10V	170 pF
Reverse Transfer Capacitance	Reverse Transfer Capacitance at VDS=10V	25 pF
Thermal Resistance	Junction-to-Ambient Thermal Resistance	120°C/W
Thermal Resistance	Junction-to-Case Thermal Resistance	45°C/W

Instructions for Use:

1. Handling Precautions:

   • Handle with care to avoid damage to the leads and body.
   • Use appropriate ESD protection to prevent damage from static electricity.

2. Mounting:

   • Ensure proper alignment of the device during mounting to avoid misalignment and damage.
   • Use a flat surface and appropriate tools to solder the device.
   • Follow recommended soldering profiles to avoid thermal shock.

3. Electrical Connections:

   • Connect the drain (D), gate (G), and source (S) terminals correctly.
   • Ensure that the gate-to-source voltage does not exceed the maximum rating of ±20 V.
   • Use suitable decoupling capacitors to stabilize the power supply.

4. Thermal Management:

   • Provide adequate heat sinking if operating near the maximum power dissipation.
   • Monitor the junction temperature to ensure it stays within the operating range.

5. Storage:

   • Store in a dry, cool place away from direct sunlight and corrosive environments.
   • Keep the devices in their original packaging until ready for use to protect against moisture and static.

6. Testing:

   • Use a multimeter or an appropriate test setup to verify the functionality of the device.
   • Refer to the datasheet for specific test conditions and procedures.

7. Disposal:

   • Dispose of the device in accordance with local environmental regulations.
   • Recycle where possible to minimize environmental impact.

(For reference only)