Details

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BUY 74ACT16245DL https://www.utsource.net/itm/p/11653700.html

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Supply Voltage	VCC	1.65	-	3.6	V	-
Output High-Level Voltage	VOH	-	-	VCC - 0.1	V	IOL = -4 mA, VCC = 3.3 V
Output Low-Level Voltage	VOL	0	-	0.2	V	IOL = 8 mA, VCC = 3.3 V
Input High-Level Voltage	VIH	2.0	-	VCC	V	-
Input Low-Level Voltage	VIL	0	-	0.8	V	-
Input Leakage Current	IIL	-1	-	1	渭A	VIN = 0 V or VCC
Output Leakage Current	IOL	-1	-	1	渭A	VOUT = 0 V or VCC
Propagation Delay Time	tpd	2.5	3.5	5.0	ns	VCC = 3.3 V, TA = 25掳C, CL = 15 pF
Power Dissipation	PD	-	-	330	mW	Per Package
Operating Temperature Range	TA	-40	-	85	掳C	-
Storage Temperature Range	TSTG	-65	-	150	掳C	-

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the range of 1.65 V to 3.6 V.
   • Connect V_CC to the power supply and GND to ground.

2. Input and Output Levels:

   • For proper operation, input signals should be within the specified high (V_IH) and low (V_IL) levels.
   • Output signals will be within the specified high (V_OH) and low (V_OL) levels.

3. Current Limits:

   • Do not exceed the maximum output current ratings to avoid damage to the device.
   • Ensure that the input leakage current (I_IL) and output leakage current (I_OL) are within the specified limits.

4. Propagation Delay:

   • The propagation delay time (t_pd) is crucial for timing considerations in your circuit. Ensure that your design accounts for this delay.

5. Temperature:

   • The device is designed to operate within the temperature range of -40掳C to 85掳C. Store the device within the storage temperature range of -65掳C to 150掳C.

6. Power Dissipation:

   • The maximum power dissipation per package is 330 mW. Ensure adequate heat dissipation if operating near this limit.

7. Handling:

   • Handle the device with care to avoid static discharge, which can damage the IC.
   • Follow standard ESD (Electrostatic Discharge) precautions when handling and installing the device.

8. Pin Configuration:

   • Refer to the datasheet for the specific pin configuration and ensure correct connections to avoid damage.

9. Testing:

   • Before finalizing the design, test the device under various conditions to ensure it meets the required performance specifications.

(For reference only)