Details

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BUY 74HC574N https://www.utsource.net/itm/p/11653723.html

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Supply Voltage	VCC	2.0	-	6.0	V
Input Voltage (High)	VIH	3.15	-	VCC	V	VIL < VIH < VCC
Input Voltage (Low)	VIL	0	-	0.85	V	VIL < VIH < VCC
Output Voltage (High)	VOH	2.4	-	VCC-0.1	V	IO = -4mA
Output Voltage (Low)	VOL	0	-	0.1	V	IO = 4mA
Input Current (High)	IIH	-	1	20	渭A	VI = VCC
Input Current (Low)	IIL	-1	-	-	渭A	VI = 0V
Output Current (High)	IOH	-	-	-4	mA	VO = VCC-1.5V
Output Current (Low)	IOL	4	-	-	mA	VO = 0.5V
Propagation Delay Time	tpd	-	25	70	ns	VCC = 5V, TA = 25掳C
Power Dissipation	PD	-	-	100	mW	Per Package
Operating Temperature	TA	-40	-	85	掳C
Storage Temperature	TSTG	-65	-	150	掳C

Instructions for Use:

1. Power Supply:

   • Connect the V_CC pin to a supply voltage between 2.0V and 6.0V.
   • Ground the GND pin.

2. Input Signals:

   • Apply logic high (V_IH) or low (V_IL) signals to the data input pins (D0-D7).
   • Ensure the input voltages are within the specified range to avoid damage.

3. Output Signals:

   • The output pins (Q0-Q7) will reflect the state of the input pins when the clock (CP) is active.
   • Ensure the load on the output pins does not exceed the maximum output current ratings.

4. Clock Signal:

   • The latch enable (LE) pin must be high for the data to be transferred from the input to the output.
   • The clock (CP) signal should be used to control the timing of the data transfer.

5. Operating Temperature:

   • Operate the device within the temperature range of -40掳C to 85掳C to ensure reliable performance.

6. Storage Temperature:

   • Store the device in an environment with temperatures ranging from -65掳C to 150掳C to prevent damage.

7. Handling:

   • Handle the device with care to avoid static discharge and physical damage.
   • Follow proper ESD (Electrostatic Discharge) precautions when handling the device.

8. Testing:

   • Before integrating the 74HC574N into your circuit, test it using a simple test setup to ensure it functions correctly.

9. Layout Considerations:

   • Place the device close to other components to minimize signal trace lengths and reduce noise.
   • Use decoupling capacitors (e.g., 0.1渭F) near the power supply pins to filter out noise.

10. Power Dissipation:

    • Ensure the total power dissipation does not exceed 100mW to avoid overheating.
    • If necessary, use heat sinks or other cooling methods to manage thermal dissipation.

(For reference only)