Details

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BUY CD4512BF https://www.utsource.net/itm/p/11654948.html

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Supply Voltage	VCC	3	-	18	V	-
Input Low Voltage	VIL	-	0.8	2.0	V	VCC = 5V
Input High Voltage	VIH	3.0	-	VCC	V	VCC = 5V
Output Low Voltage	VOL	0.1	-	0.6	V	IOL = 16mA, VCC = 5V
Output High Voltage	VOH	2.4	-	VCC-0.5	V	IOH = -0.4mA, VCC = 5V
Propagation Delay Time	tpd	-	27	95	ns	VCC = 5V, f = 10MHz
Power Dissipation	PD	-	-	500	mW	Per Package
Operating Temperature	TA	-40	-	85	掳C	-
Storage Temperature	TSTG	-65	-	150	掳C	-

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the specified range (3V to 18V).
   • Connect the ground (GND) pin to a stable ground reference.

2. Input Signals:

   • Input signals should be within the valid input voltage range.
   • For V_CC = 5V, input low (V_IL) should be less than 2.0V, and input high (V_IH) should be greater than 3.0V.

3. Output Signals:

   • When the output is low (V_OL), it should not exceed 0.6V when sourcing 16mA.
   • When the output is high (V_OH), it should be at least 2.4V when sinking 0.4mA.

4. Propagation Delay:

   • The propagation delay time (t_pd) is the time it takes for the output to change state after the input changes. It is typically 27ns at V_CC = 5V and f = 10MHz.

5. Thermal Management:

   • Ensure the device operates within the specified temperature ranges to avoid damage.
   • The operating temperature (T_A) should be between -40掳C and 85掳C.
   • The storage temperature (T_STG) should be between -65掳C and 150掳C.

6. Power Dissipation:

   • The maximum power dissipation per package is 500mW. Ensure adequate heat sinking if operating near this limit.

7. Handling:

   • Handle the device with care to avoid static discharge which can damage the IC.
   • Follow proper soldering techniques to ensure reliable connections.

(For reference only)