FA80386EX33

FA80386EX33


Specifications
SKU
11655707
Details

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Parameter Value Description
Part Number FA80386EX33 32-bit Microprocessor
Package Type PGA (Pin Grid Array) 132-pin package
Operating Voltage 5.0V 卤 5% Supply voltage for the microprocessor
Clock Frequency 16 MHz, 20 MHz, 25 MHz, 33 MHz Available clock speeds
Data Bus Width 32 bits Width of the data bus
Address Bus Width 32 bits Width of the address bus
Cache 8 KB On-chip cache memory
Power Consumption 4.0W (Typical) Power consumption at maximum clock speed
Temperature Range 0掳C to 70掳C Operating temperature range
I/O Standards TTL Input/Output standards
Multiprocessing Supported Capable of multiprocessing configurations
Instruction Set x86 Supports the x86 instruction set
Fabrication Process HMOS-III High-performance MOS technology
Lead Finish SnPb (Tin-Lead) Lead finish material

Instructions for Use

  1. Power Supply:

    • Ensure that the supply voltage is within the specified range (5.0V 卤 5%).
    • Use appropriate decoupling capacitors (0.1 渭F and 10 渭F) near the power pins to reduce noise.
  2. Clock Configuration:

    • Connect an external crystal or oscillator to the XTAL1 and XTAL2 pins to provide the required clock frequency.
    • For stable operation, use a high-quality crystal with a low tolerance.
  3. Reset Circuit:

    • Connect a reset circuit to the RESET pin to ensure proper initialization.
    • The reset signal should be held high for at least 100 渭s after power-up.
  4. Bus Configuration:

    • Configure the data and address buses according to the system requirements.
    • Ensure proper termination and signal integrity on the buses to avoid data corruption.
  5. Heat Dissipation:

    • Provide adequate heat dissipation to keep the microprocessor within the operating temperature range.
    • Consider using a heatsink if necessary.
  6. Programming:

    • Use a compatible development environment and tools to program the microprocessor.
    • Follow the programming guidelines provided in the datasheet for optimal performance.
  7. Multiprocessing:

    • If using in a multiprocessing configuration, ensure that all processors are properly synchronized and communicate effectively.
  8. Storage and Handling:

    • Store the microprocessor in a dry, static-free environment.
    • Handle with care to avoid damage to the pins and package.

For detailed specifications and additional information, refer to the official datasheet and application notes provided by the manufacturer.

(For reference only)

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