Details
BUY GS1574ACNE3 https://www.utsource.net/itm/p/11655882.html
Parameter | Symbol | Min | Typ | Max | Unit |
---|---|---|---|---|---|
Supply Voltage | Vcc | 2.7 | - | 5.5 | V |
Output Current per Channel | Iout | - | 20 | 25 | mA |
Operating Temperature | Topr | -40 | - | 85 | 掳C |
Storage Temperature | Tstg | -65 | - | 150 | 掳C |
Input Leakage Current | Iin | - | 1 | - | 渭A |
High-Level Input Voltage | VIH | 2.0 | - | Vcc | V |
Low-Level Input Voltage | VIL | 0 | - | 0.8 | V |
Propagation Delay Time | tpd | - | 10 | 20 | ns |
Power Dissipation | Pd | - | - | 100 | mW |
Instructions for Use:
Power Supply:
- Ensure the supply voltage (Vcc) is within the range of 2.7V to 5.5V.
- Connect the power supply to the Vcc pin and ground to the GND pin.
Input Signals:
- Apply high-level input voltages (VIH) between 2.0V and Vcc.
- Apply low-level input voltages (VIL) between 0V and 0.8V.
- Ensure input leakage current (Iin) does not exceed 1渭A.
Output Current:
- The maximum output current per channel (Iout) should not exceed 25mA.
- Typical output current is 20mA.
Temperature Considerations:
- Operate the device within the temperature range of -40掳C to 85掳C.
- Store the device within the temperature range of -65掳C to 150掳C.
Propagation Delay:
- The typical propagation delay time (tpd) is 10ns with a maximum of 20ns.
Power Dissipation:
- Ensure the total power dissipation (Pd) does not exceed 100mW.
Handling:
- Handle the device with care to avoid static discharge.
- Follow standard ESD (Electrostatic Discharge) precautions.
Mounting:
- Solder the device using appropriate temperatures and times to avoid damage.
- Ensure proper thermal management if operating near the maximum power dissipation.
Testing:
- Verify all connections and parameters before final assembly.
- Test the device under normal operating conditions to ensure functionality.
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