Details

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BUY MT29F8G08ABABAWP https://www.utsource.net/itm/p/11657990.html

Parameter	Description	Value	Unit
Device Type	NAND Flash Memory	-	-
Density	Storage Capacity	8 Gb (1 GB)	-
Organization	Page/Block Size	4096 Bytes + 224 Bytes / 64K Pages per Block	-
Vcc Range	Operating Voltage	2.7 to 3.6	V
I/O Voltage	I/O Voltage	1.7 to 1.95	V
Operating Temperature	Industrial Grade	-40 to +85	掳C
Package	Package Type	63-Ball FBGA	-
Ball Pitch	Ball Pitch	0.5	mm
Ball Array	Ball Array	8x8	-
Data Rate	Read/Write Speed	Up to 40	MB/s
ECC Requirement	Error Correction Code	1 bit per 512 bytes	-
Endurance	Program/Erase Cycles	10,000	-
Retention	Data Retention	10 years at 25掳C	-
Access Time	Page Read Access Time	70	渭s
Program Time	Page Program Time	300	渭s
Erase Time	Block Erase Time	1.5	ms

Instructions for Use

1. Power Supply:

   • Ensure that the Vcc supply is within the range of 2.7 to 3.6V.
   • The I/O voltage should be set between 1.7 to 1.95V.

2. Temperature:

   • Operate the device within the temperature range of -40掳C to +85掳C for industrial applications.

3. Programming:

   • Use the provided command set to program and erase the memory.
   • Ensure that the ECC (Error Correction Code) is implemented to correct single-bit errors in 512-byte data blocks.

4. Data Retention:

   • Data retention is guaranteed for up to 10 years at 25掳C. Store the device in a cool, dry environment to maximize retention.

5. Endurance:

   • The device is rated for 10,000 program/erase cycles. Avoid excessive cycling to prolong the lifespan of the memory.

6. Timing:

   • Page read access time is 70 渭s, page program time is 300 渭s, and block erase time is 1.5 ms. Design your system to accommodate these timing parameters.

7. Package Handling:

   • Handle the 63-ball FBGA package with care to avoid damage to the balls. Follow standard ESD (Electrostatic Discharge) precautions.

8. Compatibility:

   • Ensure that your system is compatible with the 8x8 ball array and 0.5 mm pitch of the FBGA package.

9. Initialization:

   • Initialize the device by sending the appropriate reset and status check commands as specified in the datasheet.

10. Documentation:

    • Refer to the full datasheet for detailed command sequences, timing diagrams, and other technical specifications.

(For reference only)