Details

BUY RJH30E3 https://www.utsource.net/itm/p/11659243.html

Parameter Symbol Min Typ Max Unit Description
Input Voltage VIN 4.5 - 28 V Operating input voltage range
Output Voltage VOUT 1.2 - 20 V Adjustable output voltage range
Output Current IOUT - 3 5 A Continuous output current
Efficiency - 90 - % Typical efficiency
Switching Frequency fSW - 500 - kHz Switching frequency
Quiescent Current IQ - 10 - 渭A Quiescent current
Dropout Voltage VDROPOUT - 1.2 - V Dropout voltage
Operating Temperature TOPR -40 - 125 掳C Operating temperature range
Storage Temperature TSTG -65 - 150 掳C Storage temperature range

Instructions:

  1. Input Connection:

    • Connect the input voltage (VIN) to the designated pin on the RJH30E3.
    • Ensure the input voltage is within the specified range (4.5V to 28V).
  2. Output Configuration:

    • Adjust the output voltage (VOUT) using the external resistor network as per the datasheet.
    • The output voltage can be set between 1.2V and 20V.
  3. Load Connection:

    • Connect the load to the output pins (VOUT and GND).
    • The maximum continuous output current is 5A, with a typical value of 3A.
  4. Efficiency:

    • The typical efficiency of the RJH30E3 is 90%, ensuring minimal power loss.
  5. Switching Frequency:

    • The switching frequency is fixed at 500kHz, which helps in reducing the size of external components.
  6. Quiescent Current:

    • The quiescent current is typically 10渭A, contributing to low standby power consumption.
  7. Thermal Management:

    • Ensure proper heat dissipation to maintain the operating temperature within the range of -40掳C to 125掳C.
    • Store the device in an environment where the temperature does not exceed -65掳C to 150掳C.
  8. Protection Features:

    • The device includes overcurrent protection, thermal shutdown, and short-circuit protection to ensure reliable operation.
  9. Mounting:

    • Solder the RJH30E3 to the PCB following the recommended footprint and soldering profile provided in the datasheet.
  10. Testing:

    • After assembly, test the device under various conditions to ensure it meets the required specifications and performance criteria.
(For reference only)

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