RJH30E3
Specifications
SKU
11659243
Details
BUY RJH30E3 https://www.utsource.net/itm/p/11659243.html
| Parameter | Symbol | Min | Typ | Max | Unit | Description |
|---|---|---|---|---|---|---|
| Input Voltage | VIN | 4.5 | - | 28 | V | Operating input voltage range |
| Output Voltage | VOUT | 1.2 | - | 20 | V | Adjustable output voltage range |
| Output Current | IOUT | - | 3 | 5 | A | Continuous output current |
| Efficiency | 畏 | - | 90 | - | % | Typical efficiency |
| Switching Frequency | fSW | - | 500 | - | kHz | Switching frequency |
| Quiescent Current | IQ | - | 10 | - | 渭A | Quiescent current |
| Dropout Voltage | VDROPOUT | - | 1.2 | - | V | Dropout voltage |
| Operating Temperature | TOPR | -40 | - | 125 | 掳C | Operating temperature range |
| Storage Temperature | TSTG | -65 | - | 150 | 掳C | Storage temperature range |
Instructions:
Input Connection:
- Connect the input voltage (VIN) to the designated pin on the RJH30E3.
- Ensure the input voltage is within the specified range (4.5V to 28V).
Output Configuration:
- Adjust the output voltage (VOUT) using the external resistor network as per the datasheet.
- The output voltage can be set between 1.2V and 20V.
Load Connection:
- Connect the load to the output pins (VOUT and GND).
- The maximum continuous output current is 5A, with a typical value of 3A.
Efficiency:
- The typical efficiency of the RJH30E3 is 90%, ensuring minimal power loss.
Switching Frequency:
- The switching frequency is fixed at 500kHz, which helps in reducing the size of external components.
Quiescent Current:
- The quiescent current is typically 10渭A, contributing to low standby power consumption.
Thermal Management:
- Ensure proper heat dissipation to maintain the operating temperature within the range of -40掳C to 125掳C.
- Store the device in an environment where the temperature does not exceed -65掳C to 150掳C.
Protection Features:
- The device includes overcurrent protection, thermal shutdown, and short-circuit protection to ensure reliable operation.
Mounting:
- Solder the RJH30E3 to the PCB following the recommended footprint and soldering profile provided in the datasheet.
Testing:
- After assembly, test the device under various conditions to ensure it meets the required specifications and performance criteria.
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