Details

BUY SN8P2722SG https://www.utsource.net/itm/p/11659912.html

Parameter Description Min Typ Max Unit
Supply Voltage (VDD) Operating voltage range 2.0 - 5.5 V
Operating Temperature Temperature range for operation -40 - 85 掳C
Storage Temperature Temperature range for storage -65 - 150 掳C
I/O Pin Voltage Maximum voltage on I/O pins 0 - VDD + 0.3 V
Input Leakage Current Leakage current on input pins -1.0 - 1.0 渭A
Output Drive Current (High Level) Maximum output current when high - 10 - mA
Output Drive Current (Low Level) Maximum output current when low - -10 - mA
Power Consumption Typical power consumption at 5V, 25掳C - 2.0 - mA
Clock Frequency Maximum clock frequency - 24 - MHz
Programming Voltage (VPP) Programming voltage for flash memory 12.0 - 13.0 V
Programming Time Time required for programming - 10 - ms
Erase Time Time required for erasing - 10 - ms

Instructions for SN8P2722SG

  1. Power Supply:

    • Ensure the supply voltage (VDD) is within the range of 2.0V to 5.5V.
    • Connect the VSS pin to ground.
  2. Temperature Considerations:

    • Operate the device within the temperature range of -40掳C to 85掳C.
    • Store the device within the temperature range of -65掳C to 150掳C.
  3. I/O Pin Handling:

    • Do not apply voltages outside the range of 0V to VDD + 0.3V on any I/O pins.
    • Ensure input leakage current does not exceed 卤1.0 渭A.
  4. Output Drive:

    • The device can source up to 10 mA and sink up to -10 mA on each output pin.
  5. Power Consumption:

    • The typical power consumption is 2.0 mA at 5V and 25掳C.
  6. Clock Frequency:

    • The maximum clock frequency is 24 MHz.
  7. Programming:

    • Use a programming voltage (VPP) of 12.0V to 13.0V for flash memory programming.
    • Programming typically takes 10 ms.
  8. Erasing:

    • Erasing the flash memory also takes approximately 10 ms.
  9. General Handling:

    • Handle the device with care to avoid static discharge.
    • Follow proper soldering techniques to ensure reliable connections.
  10. Storage:

    • Store the device in a dry, cool place to prevent moisture damage.

For detailed specifications and additional information, refer to the official datasheet provided by the manufacturer.

(For reference only)

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