Details

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BUY TLP596G https://www.utsource.net/itm/p/11660443.html

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Forward Voltage	VF	-	1.2	1.6	V	IF = 10 mA
Forward Current	IF	-	-	30	mA	Continuous
Peak Forward Current	IFP	-	-	100	mA	tP = 1 ms, Repetition Rate = 100 Hz
Reverse Voltage	VR	-	-	5	V
Output Collector-Emitter Voltage	VCEO	-	-	30	V	IC = 100 mA
Output Collector Current	IC	-	-	100	mA	VCEO = 30 V
Output Turn-On Time	tON	-	1	5	渭s	IF = 10 mA, RL = 100 惟
Output Turn-Off Time	tOFF	-	1	5	渭s	IF = 10 mA, RL = 100 惟
Isolation Voltage	VIORM	-	-	2500	Vrms	Test Condition: 1 min
Operating Temperature	TOPR	-40	-	105	掳C
Storage Temperature	TSTG	-55	-	125	掳C

Instructions for Use:

1. Forward Current (IF):

   • Ensure that the forward current does not exceed 30 mA continuously.
   • For peak applications, do not exceed 100 mA with a pulse width of 1 ms and a repetition rate of 100 Hz.

2. Reverse Voltage (VR):

   • The reverse voltage should not exceed 5 V to avoid damage to the device.

3. Output Collector-Emitter Voltage (VCEO):

   • Ensure that the collector-emitter voltage does not exceed 30 V when the collector current is 100 mA.

4. Output Collector Current (IC):

   • The maximum collector current should not exceed 100 mA at a collector-emitter voltage of 30 V.

5. Output Turn-On and Turn-Off Times:

   • The typical turn-on and turn-off times are 1 渭s, but they can vary up to 5 渭s. Ensure that your circuit design accounts for these times to avoid transient issues.

6. Isolation Voltage (VIORM):

   • The isolation voltage is 2500 Vrms, tested for 1 minute. Ensure that the input and output circuits are properly isolated to maintain this rating.

7. Operating and Storage Temperature:

   • The operating temperature range is from -40掳C to 105掳C.
   • The storage temperature range is from -55掳C to 125掳C.

8. Handling Precautions:

   • Handle the TLP596G with care to avoid static discharge and physical damage.
   • Ensure proper heat sinking if the device is expected to dissipate significant power.

9. Mounting:

   • Follow recommended PCB layout guidelines to ensure optimal performance and thermal management.
   • Use appropriate soldering techniques to avoid overheating the device during assembly.

10. Testing:

    • When testing the device, use the specified test conditions to ensure accurate measurements and avoid damaging the device.

(For reference only)