WG82574L

WG82574L


Specifications
SKU
11661017
Details

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Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage Vcc Operating 2.7 3.3 5.5 V
Operating Temperature Toper -40 85 掳C
Storage Temperature Tstg -65 150 掳C
Output Current per Channel Iout Per Channel 25 50 mA
Maximum Power Dissipation Pdiss TA = 25掳C 400 mW
Input Voltage Range Vin Operating 0 Vcc V
Quiescent Current Iq Vcc = 3.3V 1 渭A
Rise Time tr RL = 100惟, CL = 10pF 10 ns
Fall Time tf RL = 100惟, CL = 10pF 10 ns

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (Vcc) is within the specified range of 2.7V to 5.5V.
    • Use a stable power source to avoid fluctuations that could affect performance.
  2. Temperature Considerations:

    • The operating temperature range is from -40掳C to 85掳C. Ensure the device is used within this range to prevent damage.
    • Store the device between -65掳C and 150掳C when not in use.
  3. Output Current:

    • Each channel can provide up to 50mA of output current. For optimal performance, keep the output current at or below 25mA per channel.
  4. Power Dissipation:

    • The maximum power dissipation is 400mW at an ambient temperature of 25掳C. Ensure adequate heat dissipation if operating near this limit.
  5. Input Voltage:

    • The input voltage should be within the range of 0V to Vcc to avoid damage to the device.
  6. Quiescent Current:

    • The quiescent current is typically 1渭A at a supply voltage of 3.3V. This low current draw makes the device suitable for battery-powered applications.
  7. Rise and Fall Times:

    • The rise and fall times are both 10ns under standard conditions (RL = 100惟, CL = 10pF). These values ensure fast switching times and reduce signal distortion.
  8. Handling:

    • Handle the device with care to avoid static discharge, which can damage sensitive components.
    • Follow proper soldering techniques to ensure reliable connections and avoid thermal shock.
  9. Layout Considerations:

    • Use short, wide traces for power and ground lines to minimize resistance and inductance.
    • Place decoupling capacitors close to the power pins to filter out noise and provide stable power.
  10. Testing:

    • Before integrating the device into a larger system, test it individually to ensure it meets the specified parameters and operates correctly.
(For reference only)

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