Details

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BUY TSA20N50M 20N50 N CHANNEL MOSFET TO-3P 500V 20A https://www.utsource.net/itm/p/11661504.html

Parameter	Symbol	Value	Unit
Drain-Source Voltage	VDSS	500	V
Continuous Drain Current	ID	20	A
Gate-Source Voltage	VGS	卤20	V
Gate-Threshold Voltage	VGS(th)	2.0 to 4.0	V
RDS(on) at VGS = 10V	-	0.75	惟
Total Power Dissipation	PTOT	125	W
Junction Temperature	TJ	-55 to 150	掳C
Storage Temperature	TSTG	-55 to 150	掳C
Lead Temperature (Soldering, 10s)	-	300	掳C

Instructions for Use:

1. Handling Precautions:

   • ESD Sensitivity: The TSA20N50M is sensitive to electrostatic discharge (ESD). Use proper ESD protection when handling the device.
   • Gate Protection: Avoid applying voltages greater than 卤20V to the gate relative to the source to prevent damage.

2. Mounting:

   • Thermal Management: Ensure adequate heat sinking to manage the maximum power dissipation of 125W. Use thermal paste between the device and the heat sink for optimal thermal performance.
   • Mechanical Stress: Avoid excessive mechanical stress on the leads during soldering and assembly. Follow the recommended soldering profile to prevent damage.

3. Operating Conditions:

   • Junction Temperature: Ensure that the junction temperature does not exceed 150掳C to avoid thermal runaway and potential device failure.
   • Continuous Operation: Do not exceed the continuous drain current of 20A or the drain-source voltage of 500V to prevent overloading the device.

4. Testing:

   • Initial Testing: Perform initial testing with low currents and voltages to ensure the device is functioning correctly before operating at full ratings.
   • Parameter Verification: Verify key parameters such as R_DS(on) and V_GS(th) using appropriate test equipment to ensure the device meets specifications.

5. Storage:

   • Temperature Range: Store the device in a dry environment within the temperature range of -55掳C to 150掳C.
   • Humidity Control: Use desiccant packets or a humidity-controlled environment to prevent moisture absorption, which can lead to corrosion or other issues.

6. Soldering:

   • Soldering Temperature: Do not exceed a lead temperature of 300掳C for more than 10 seconds during soldering.
   • Cooling: Allow the device to cool naturally after soldering to avoid thermal shock.

By following these guidelines, you can ensure the reliable operation and longevity of the TSA20N50M N-Channel MOSFET.

(For reference only)