Details

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BUY TC74HC273AF(EL,F) https://www.utsource.net/itm/p/11662590.html
IC FF D-TYPE SNGL 8BIT 20SOP

Parameter	Symbol	Min	Typical	Max	Unit	Conditions
Supply Voltage	VCC	2.0	-	6.0	V	-
Input Low Voltage	VIL	-	-	1.5	V	VCC = 4.5V to 5.5V
Input High Voltage	VIH	3.5	-	-	V	VCC = 4.5V to 5.5V
Output Low Voltage	VOL	-	0.1	0.4	V	IOL = 8mA, VCC = 4.5V to 5.5V
Output High Voltage	VOH	4.4	-	-	V	IOH = -0.4mA, VCC = 4.5V to 5.5V
Input Leakage Current	IIL	-	-	±1	μA	VCC = 4.5V to 5.5V
Output Leakage Current	IOL	-	-	±1	μA	VCC = 4.5V to 5.5V
Propagation Delay Time	tpd	-	15	40	ns	VCC = 5V, TA = 25°C
Power Dissipation	PD	-	-	100	mW	TA = 25°C
Operating Temperature	TA	-40	-	85	°C	-
Storage Temperature	TSTG	-65	-	150	°C	-

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the range of 2.0V to 6.0V.
   • Connect the ground (GND) pin to a stable 0V reference.

2. Input Signals:

   • Apply input signals that meet the specified input voltage levels (V_IL and V_IH).
   • Avoid exceeding the maximum input voltage levels to prevent damage.

3. Output Loads:

   • Ensure the output load currents do not exceed the specified limits (I_OL and I_OH).
   • Check the output voltage levels (V_OL and V_OH) to ensure proper logic levels.

4. Propagation Delay:

   • Consider the propagation delay time (t_pd) in your timing calculations to ensure reliable operation.

5. Temperature:

   • Operate the device within the specified temperature range (T_A) to avoid thermal stress.
   • Store the device within the storage temperature range (T_STG) to prevent damage.

6. Handling:

   • Handle the device with care to avoid static discharge, which can damage sensitive components.
   • Follow proper soldering techniques to ensure good electrical connections and avoid thermal shock.

7. Decoupling Capacitors:

   • Place decoupling capacitors close to the power pins to filter out noise and provide stable power supply.

8. Layout:

   • Design the PCB layout to minimize trace lengths and reduce parasitic inductance and capacitance.

9. Testing:

   • Test the device under various conditions to ensure it meets the required performance specifications.

10. Compliance:

    • Ensure the device complies with relevant safety and regulatory standards for your application.

(For reference only)