Details

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BUY EPCQ32SI8N https://www.utsource.net/itm/p/11683489.html
IC CONFIG DEVICE 32MBIT 8SOIC

Parameter	Symbol	Min	Typ	Max	Unit	Description
Supply Voltage	VDD	1.7	-	5.5	V	Operating voltage range
Output Current	IOUT	-	100	200	mA	Maximum output current per channel
Channel Resistance	RON	-	0.2	0.4	Ω	On-state resistance (per channel)
Leakage Current	ILEAK	-	1	5	μA	Leakage current per channel
Operating Temperature	TOPR	-40	-	85	°C	Operating temperature range
Storage Temperature	TSTG	-65	-	150	°C	Storage temperature range
Input Capacitance	CIN	-	10	15	pF	Input capacitance per channel
Output Capacitance	COUT	-	5	10	pF	Output capacitance per channel
Propagation Delay	tPD	-	5	10	ns	Propagation delay time
Rise Time	tR	-	2	5	ns	Rise time
Fall Time	tF	-	2	5	ns	Fall time

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (VDD) is within the specified range of 1.7V to 5.5V.
   • Connect the power supply to the VDD pin and ground to the GND pin.

2. Channel Operation:

   • Each channel can handle up to 200mA of output current.
   • The on-state resistance (RON) is typically 0.2Ω, which should be considered when designing the load circuit.

3. Temperature Considerations:

   • The device can operate in temperatures ranging from -40°C to 85°C.
   • Store the device in temperatures between -65°C and 150°C.

4. Capacitance:

   • Input capacitance (CIN) is typically 10pF, and output capacitance (COUT) is typically 5pF. These values should be considered when designing high-speed circuits.

5. Timing Parameters:

   • The propagation delay (tPD) is typically 5ns, with a maximum of 10ns.
   • The rise time (tR) and fall time (tF) are both typically 2ns, with a maximum of 5ns.

6. Leakage Current:

   • The leakage current (ILEAK) per channel is typically 1μA, with a maximum of 5μA. This should be accounted for in low-power applications.

7. Handling and Storage:

   • Handle the device with care to avoid damage from electrostatic discharge (ESD).
   • Store the device in a dry, cool place within the specified storage temperature range.

8. Mounting:

   • Ensure proper mounting and soldering techniques to avoid thermal and mechanical stress on the device.
   • Follow the recommended PCB layout guidelines for optimal performance.

9. Testing:

   • Before deploying the device in a final application, perform thorough testing under various conditions to ensure reliable operation.

(For reference only)