Details

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BUY SN74HC109N https://www.utsource.net/itm/p/11690358.html
IC FF JK TYPE DUAL 1BIT 16DIP

Parameter	Symbol	Conditions	Min	Typical	Max	Unit
Supply Voltage	VCC	Operating	2.0	-	6.0	V
Input Low Voltage	VIL	VCC = 4.5V to 5.5V	0.8	-	-	V
Input High Voltage	VIH	VCC = 4.5V to 5.5V	-	-	2.0	V
Output Low Voltage	VOL	IOL = 4mA, VCC = 4.5V to 5.5V	0.1	-	-	V
Output High Voltage	VOH	IOH = -0.4mA, VCC = 4.5V to 5.5V	-	-	4.7	V
Propagation Delay Time (Typical)	tpd	VCC = 5V, TA = 25°C	-	13	-	ns
Power Dissipation	PD	Continuous	-	-	100	mW
Operating Temperature Range	TA	-	-40	-	85	°C
Storage Temperature Range	TSTG	-	-65	-	150	°C

Instructions for Using SN74HC109N:

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the range of 2.0V to 6.0V.
   • Connect V_CC to the positive power supply and GND to the ground.

2. Input Signals:

   • For a logic low input, ensure the voltage (V_IL) is below 0.8V.
   • For a logic high input, ensure the voltage (V_IH) is above 2.0V.

3. Output Signals:

   • The output low voltage (V_OL) should not exceed 0.1V when sinking 4mA.
   • The output high voltage (V_OH) should be at least 4.7V when sourcing -0.4mA.

4. Propagation Delay:

   • The typical propagation delay time (t_pd) is 13ns at V_CC = 5V and T_A = 25°C.

5. Temperature Considerations:

   • The operating temperature range (T_A) is from -40°C to 85°C.
   • The storage temperature range (T_STG) is from -65°C to 150°C.

6. Power Dissipation:

   • Ensure that the power dissipation (P_D) does not exceed 100mW continuously.

7. Handling:

   • Handle the device with care to avoid damage from electrostatic discharge (ESD).
   • Use appropriate ESD protection measures during handling and assembly.

8. Layout and PCB Design:

   • Ensure proper layout and PCB design to minimize noise and crosstalk.
   • Use decoupling capacitors close to the power pins to stabilize the power supply.

9. Testing:

   • Test the device under specified conditions to ensure it meets the required performance parameters.

(For reference only)