Details

---

BUY SN74LS32NE4 https://www.utsource.net/itm/p/11690822.html
IC GATE OR 4CH 2-INP 14DIP

Parameter	Symbol	Min	Typical	Max	Unit	Notes
Supply Voltage	VCC	4.75	5.0	5.25	V
Input Low Voltage	VIL	0.0	0.8	-	V
Input High Voltage	VIH	2.0	3.5	-	V
Output Low Voltage	VOL	0.0	0.4	0.5	V
Output High Voltage	VOH	2.7	3.5	5.0	V
Propagation Delay Time	tpd	-	15	22	ns
Power Dissipation	PD	-	-	100	mW
Operating Temperature	TA	-55	-	125	°C
Storage Temperature	TSTG	-65	-	150	°C

Instructions for Use:

1. Supply Voltage (V_CC):

   • Ensure the supply voltage is within the range of 4.75V to 5.25V to avoid damage to the device.

2. Input Voltages:

   • For a logic low input, the voltage should be less than or equal to 0.8V.
   • For a logic high input, the voltage should be greater than or equal to 2.0V.

3. Output Voltages:

   • When the output is low, the voltage will be between 0.0V and 0.5V.
   • When the output is high, the voltage will be between 2.7V and 5.0V.

4. Propagation Delay Time (t_pd):

   • The typical propagation delay time is 15ns, with a maximum of 22ns. This is the time it takes for the output to change state after the input changes.

5. Power Dissipation (P_D):

   • The maximum power dissipation is 100mW. Ensure that the device is not subjected to excessive power to prevent overheating and potential damage.

6. Operating Temperature (T_A):

   • The device can operate within a temperature range of -55°C to 125°C. Ensure that the ambient temperature does not exceed these limits.

7. Storage Temperature (T_STG):

   • The device can be stored in temperatures ranging from -65°C to 150°C. However, prolonged exposure to extreme temperatures may affect performance.

8. Handling:

   • Handle the device with care to avoid static discharge, which can damage the internal circuits. Use proper ESD (Electrostatic Discharge) protection measures.

9. Mounting:

   • Ensure that the device is properly mounted on the PCB (Printed Circuit Board) to maintain good electrical connections and thermal management.

10. Testing:

    • Before final assembly, test the device to ensure it meets the specified parameters and functions correctly.

(For reference only)