Details

---

BUY CD4503BE https://www.utsource.net/itm/p/11691227.html
IC BUFFER NON-INVERT 18 V 16DIP

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	VCC	Operating	3.0	-	18	V
Input Low Voltage	VIL	-	0	-	0.8	V
Input High Voltage	VIH	-	2.0	-	VCC	V
Output Low Voltage	VOL	IOL = 0.4 mA	0	-	0.4	V
Output High Voltage	VOH	IOH = -0.4 mA	VCC - 0.4	-	VCC	V
Propagation Delay Time	tpd	VCC = 5V, TA = 25°C	-	40	-	ns
Power Dissipation	PD	Maximum at TA = 70°C	-	-	100	mW
Operating Temperature Range	TA	-	-40	-	85	°C
Storage Temperature Range	TSTG	-	-65	-	150	°C

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the operating range of 3.0V to 18V.
   • Connect the ground (GND) pin to a stable ground reference.

2. Input Signals:

   • Input signals should be within the specified input voltage levels (V_IL and V_IH).
   • Avoid exceeding the maximum input voltage, which is equal to V_CC.

3. Output Signals:

   • The output low voltage (V_OL) should not exceed 0.4V when sourcing 0.4mA.
   • The output high voltage (V_OH) should be at least V_CC - 0.4V when sinking 0.4mA.

4. Propagation Delay:

   • The typical propagation delay time (t_pd) is 40ns at V_CC = 5V and T_A = 25°C. This value can vary with different supply voltages and temperatures.

5. Power Dissipation:

   • The maximum power dissipation (P_D) is 100mW at T_A = 70°C. Ensure adequate heat dissipation if operating near this limit.

6. Temperature Considerations:

   • The device operates reliably within the temperature range of -40°C to 85°C.
   • Store the device in an environment between -65°C and 150°C.

7. Handling:

   • Handle the device with care to avoid static damage.
   • Follow standard ESD (Electrostatic Discharge) precautions during handling and assembly.

8. Schematic and Layout:

   • Refer to the datasheet for recommended schematic symbols and PCB layout guidelines to ensure optimal performance and reliability.

(For reference only)