Details

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BUY CY74FCT245TQCT https://www.utsource.net/itm/p/11692710.html
IC TXRX NON-INVERT 5.25V 20SSOP

Parameter	Description	Min	Typ	Max	Unit
Supply Voltage (VCC)	Operating supply voltage	2.0	-	5.5	V
Output Current (IOH)	Output high-level current	-	-	24	mA
Output Current (IOL)	Output low-level current	-48	-	-	mA
Input Leakage Current (II)	Input leakage current	-1	-	1	μA
Propagation Delay Time (tPD)	Propagation delay time from input to output	2.9	-	6.0	ns
Power Dissipation (PD)	Maximum power dissipation	-	-	500	mW
Operating Temperature (TA)	Ambient operating temperature range	-40	-	85	°C
Storage Temperature (TSTG)	Storage temperature range	-65	-	150	°C

Instructions for CY74FCT245TQCT:

1. Power Supply:

   • Ensure that the supply voltage (VCC) is within the specified range of 2.0V to 5.5V.
   • Connect the ground (GND) pin to a stable ground reference.

2. Signal Levels:

   • The device operates with TTL and CMOS compatible input and output levels.
   • Ensure that the input signals are within the valid logic levels for the given supply voltage.

3. Output Current:

   • Do not exceed the maximum output current ratings (IOH = 24mA, IOL = -48mA).
   • Use external resistors if necessary to limit current when driving loads.

4. Input Leakage:

   • Account for the input leakage current (±1μA) when designing pull-up or pull-down resistors.

5. Propagation Delay:

   • Consider the propagation delay (tPD) in your timing calculations to ensure proper signal integrity and synchronization.

6. Power Dissipation:

   • Ensure that the total power dissipation does not exceed 500mW to avoid overheating.
   • Use appropriate heat sinking or cooling methods if operating near the maximum power dissipation.

7. Operating Temperature:

   • The device is designed to operate within the ambient temperature range of -40°C to 85°C.
   • Avoid exposing the device to temperatures outside this range during operation.

8. Storage Temperature:

   • Store the device in an environment with temperatures ranging from -65°C to 150°C to prevent damage.

9. Handling:

   • Handle the device with care to avoid static discharge, which can damage sensitive components.
   • Use anti-static wrist straps and mats when handling the device.

10. Layout and PCB Design:

    • Follow good PCB design practices, including proper grounding, decoupling capacitors, and signal trace routing.
    • Place decoupling capacitors close to the power pins to minimize noise and improve stability.

11. Testing:

    • Before finalizing the design, test the device under various conditions to ensure it meets the required performance specifications.

(For reference only)