Details

---

BUY SN74HCT652NT https://www.utsource.net/itm/p/11698816.html
IC TXRX NON-INVERT 5.5V 24DIP

Parameter	Description	Min	Typ	Max	Unit
Supply Voltage (VCC)	Operating supply voltage range	2.0	-	6.0	V
Input Voltage (VIH)	High-level input voltage	2.0	-	VCC	V
Input Voltage (VIL)	Low-level input voltage	0	-	0.8	V
Output Voltage (VOH)	High-level output voltage	-	2.4	VCC-0.5	V
Output Voltage (VOL)	Low-level output voltage	0	-	0.4	V
Input Current (IIH)	High-level input current	-1	-	20	μA
Input Current (IIL)	Low-level input current	-1	-	1	μA
Output Current (IOH)	High-level output current	-	-	-400	mA
Output Current (IOL)	Low-level output current	-	-	400	mA
Propagation Delay Time (tPD)	Propagation delay time	5	-	18	ns
Power Dissipation (PD)	Maximum power dissipation	-	-	340	mW
Operating Temperature (Toperating)	Operating temperature range	-40	-	85	°C
Storage Temperature (Tstorage)	Storage temperature range	-65	-	150	°C

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (VCC) is within the specified range of 2.0V to 6.0V.
   • Connect the ground (GND) pin to a stable 0V reference.

2. Input Signals:

   • Apply high-level input voltages (VIH) between 2.0V and VCC.
   • Apply low-level input voltages (VIL) between 0V and 0.8V.
   • Keep input currents (IIH and IIL) within the specified limits to avoid damage.

3. Output Signals:

   • The high-level output voltage (VOH) will be between 2.4V and VCC-0.5V.
   • The low-level output voltage (VOL) will be between 0V and 0.4V.
   • Ensure that the output currents (IOH and IOL) do not exceed ±400mA to prevent damage.

4. Propagation Delay:

   • The propagation delay time (tPD) is typically between 5ns and 18ns, depending on the operating conditions.

5. Power Dissipation:

   • Do not exceed the maximum power dissipation (PD) of 340mW to avoid overheating and potential damage.

6. Temperature:

   • Operate the device within the specified operating temperature range of -40°C to 85°C.
   • Store the device within the storage temperature range of -65°C to 150°C.

7. Handling:

   • Handle the device with care to avoid static discharge, which can damage the internal circuits.
   • Follow proper soldering techniques to ensure reliable connections and prevent thermal damage.

8. Testing:

   • Perform initial testing under controlled conditions to verify proper operation before integrating into a larger system.

(For reference only)